Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The invention is applicable to the technical field of architectural decorative plates, and provides an assembly type sound insulation and absorption board and a processing method thereof. The assemblytype sound insulation and absorption board comprises a substrate mechanism and an interlayer mechanism, wherein the substrate mechanism comprises a plate body, a cavity is formed in the plate body, the interlayer mechanism comprises a base plate, a first purifying plate and a second purifying plate, and the base plate is installed in the cavity. By arranging the plate body with the cavity, forming a clamping block and a clamping groove which are matched with each other in the edges on the two sides of the plate body respectively, forming grooves and through holes in the upper and lower surfaces of the plate body, and installing the base plate with the first purifying plate and the second purifying plate in the cavity, efficient sound absorption can be achieved through the cavity, the grooves and the through holes in the plate body, a plurality of plate bodies can be assembled through the clamping blocks and the clamping grooves, and the first purifying plate and the second purifying plate can provide an air purifying function. The assembly type sound insulation and absorption board has the characteristics of being good in sound absorption effect, safe to use and convenient to assemble.
本发明适用于建筑装饰板材技术领域，提供了一种拼接型隔音吸音板及其加工方法，包括基材机构和夹层机构，所述基材机构包括板体，所述板体的内部具有一个空腔，所述夹层机构包括基板、第一净化板和第二净化板，所述基板安装在所述空腔内，通过设置带有空腔的板体，并且板体的两侧边沿分别具有相互匹配的卡块和卡槽，板体的上表面和下表面均开设有凹槽和通孔，空腔内安装有带有第一净化板和第二净化板的基板，从而能够同板体上的空腔、凹槽和通孔提供高效的吸音，同时多个板体之间可以通过卡块和卡槽进行拼接，第一净化板和第二净化板能够提供空气净化功能，本发明具有吸音效果好，使用安全和拼接方便的特点。
The invention is applicable to the technical field of architectural decorative plates, and provides an assembly type sound insulation and absorption board and a processing method thereof. The assemblytype sound insulation and absorption board comprises a substrate mechanism and an interlayer mechanism, wherein the substrate mechanism comprises a plate body, a cavity is formed in the plate body, the interlayer mechanism comprises a base plate, a first purifying plate and a second purifying plate, and the base plate is installed in the cavity. By arranging the plate body with the cavity, forming a clamping block and a clamping groove which are matched with each other in the edges on the two sides of the plate body respectively, forming grooves and through holes in the upper and lower surfaces of the plate body, and installing the base plate with the first purifying plate and the second purifying plate in the cavity, efficient sound absorption can be achieved through the cavity, the grooves and the through holes in the plate body, a plurality of plate bodies can be assembled through the clamping blocks and the clamping grooves, and the first purifying plate and the second purifying plate can provide an air purifying function. The assembly type sound insulation and absorption board has the characteristics of being good in sound absorption effect, safe to use and convenient to assemble.
本发明适用于建筑装饰板材技术领域，提供了一种拼接型隔音吸音板及其加工方法，包括基材机构和夹层机构，所述基材机构包括板体，所述板体的内部具有一个空腔，所述夹层机构包括基板、第一净化板和第二净化板，所述基板安装在所述空腔内，通过设置带有空腔的板体，并且板体的两侧边沿分别具有相互匹配的卡块和卡槽，板体的上表面和下表面均开设有凹槽和通孔，空腔内安装有带有第一净化板和第二净化板的基板，从而能够同板体上的空腔、凹槽和通孔提供高效的吸音，同时多个板体之间可以通过卡块和卡槽进行拼接，第一净化板和第二净化板能够提供空气净化功能，本发明具有吸音效果好，使用安全和拼接方便的特点。
Assembly type sound insulation and absorption board and processing method thereof
一种拼接型隔音吸音板及其加工方法
JIANG JUN (Autor:in)
19.05.2020
Patent
Elektronische Ressource
Chinesisch
Particulate Sound Barrier and Sound Absorption/Insulation Board Thereof
| Europäisches Patentamt | 2016
Particulate sound barrier and sound absorption/insulation board thereof
| Europäisches Patentamt | 2017
ENVIRONMENTALLY SOUND ABSORPTION SOUND INSULATION BOARD
| Europäisches Patentamt | 2015
Assembly type flexible sound absorption and insulation screen
| Europäisches Patentamt | 2021