Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Connected bamboo-UHPC combined bridge deck slab structure adopting grid type bamboo plate
The invention belongs to the technical field of structural engineering and relates to a connected bamboo-UHPC combined bridge deck slab structure adopting a grid type bamboo plate. The structure is composed of a top layer UHPC (1), a bottom layer bamboo bridge deck (2) and the grid type bamboo plate (3). The structure is characterized in that: recombined bamboos are selected to be prefabricated into the grooved bridge deck, and the grooved bridge deck is arranged at the layer of the structure; UHPC (1) is cast in place in the groove of the grooved bridge deck to serve as the upper layer of thecombined bridge deck; the grid type bamboo plate (3) is manufactured and arranged between the top layer UHPC (1) and the bottom layer bamboo bridge deck (2); the grid type bamboo plate (3) serves asa connecting piece to be inserted into the reserved groove of the bottom layer bamboo bridge deck (2), and the groove is filled with an epoxy resin filler (4). According to the structure of the invention, two light materials of the combined bridge deck slab are connected through the grid type bamboo plate (3), therefore, the weight of the whole combined bridge deck slab is reduced, the bonding strength of a combined structure interface is improved, the defect of insufficient flexural rigidity of bamboo is overcome, cooperative work of the two materials of the combined bridge deck slab is facilitated, and the excellent characteristics of the two materials are brought into full play.
本发明属于结构工程技术领域，具体涉及一种采用栅格式竹板连接竹‑UHPC的组合桥面板结构，其结构由顶层UHPC(1)、底层竹材桥面板(2)和栅格式竹板(3)构成，其特征在于选择重组竹预制成槽型桥面板，置于下层，槽内现浇UHPC(1)，作为组合桥面板的上层，制作栅格式竹板(3)置于顶层UHPC(1)和底层竹材桥面板(2)中部，栅格式竹板(3)作为连接件插入底层竹材桥面板(2)的预留槽内，填入环氧树脂填充物(4)。本发明通过栅格式竹板(3)连接组合桥面板的两种轻型材料，减轻整个组合桥面板的重量，提高组合结构界面的粘结强度，弥补竹材抗弯刚度不足，有利于组合桥面板的两种材料的协同工作，充分发挥两种材料的优良特性。
Connected bamboo-UHPC combined bridge deck slab structure adopting grid type bamboo plate
The invention belongs to the technical field of structural engineering and relates to a connected bamboo-UHPC combined bridge deck slab structure adopting a grid type bamboo plate. The structure is composed of a top layer UHPC (1), a bottom layer bamboo bridge deck (2) and the grid type bamboo plate (3). The structure is characterized in that: recombined bamboos are selected to be prefabricated into the grooved bridge deck, and the grooved bridge deck is arranged at the layer of the structure; UHPC (1) is cast in place in the groove of the grooved bridge deck to serve as the upper layer of thecombined bridge deck; the grid type bamboo plate (3) is manufactured and arranged between the top layer UHPC (1) and the bottom layer bamboo bridge deck (2); the grid type bamboo plate (3) serves asa connecting piece to be inserted into the reserved groove of the bottom layer bamboo bridge deck (2), and the groove is filled with an epoxy resin filler (4). According to the structure of the invention, two light materials of the combined bridge deck slab are connected through the grid type bamboo plate (3), therefore, the weight of the whole combined bridge deck slab is reduced, the bonding strength of a combined structure interface is improved, the defect of insufficient flexural rigidity of bamboo is overcome, cooperative work of the two materials of the combined bridge deck slab is facilitated, and the excellent characteristics of the two materials are brought into full play.
本发明属于结构工程技术领域，具体涉及一种采用栅格式竹板连接竹‑UHPC的组合桥面板结构，其结构由顶层UHPC(1)、底层竹材桥面板(2)和栅格式竹板(3)构成，其特征在于选择重组竹预制成槽型桥面板，置于下层，槽内现浇UHPC(1)，作为组合桥面板的上层，制作栅格式竹板(3)置于顶层UHPC(1)和底层竹材桥面板(2)中部，栅格式竹板(3)作为连接件插入底层竹材桥面板(2)的预留槽内，填入环氧树脂填充物(4)。本发明通过栅格式竹板(3)连接组合桥面板的两种轻型材料，减轻整个组合桥面板的重量，提高组合结构界面的粘结强度，弥补竹材抗弯刚度不足，有利于组合桥面板的两种材料的协同工作，充分发挥两种材料的优良特性。
Connected bamboo-UHPC combined bridge deck slab structure adopting grid type bamboo plate
一种采用栅格式竹板连接竹-UHPC的组合桥面板结构
DUAN MAOJUN (Autor:in) / SONG CAN (Autor:in) / XUE JINCHUN (Autor:in) / WEI YANG (Autor:in) / LI GUOFEN (Autor:in)
23.06.2020
Patent
Elektronische Ressource
Chinesisch
IPC:
E01D
BRIDGES
,
Brücken
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