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Cover plate ditch capable of adjusting differential settlement of buried pipe and adjusting method
The invention discloses a cover plate ditch capable of adjusting differential settlement of a buried pipe and an adjusting method, and relates to the field of soft soil foundation treatment. The coverplate ditch comprises cover plate ditch side walls, a cover plate ditch bottom plate, a cover plate, an under-pipe supporting plate, filling material pouring holes, a filling material, an inverted filter layer and a pouring hole cover, the filling material pouring holes are formed in the cover plate ditch side walls in the vertical direction at intervals, supporting plate preformed holes are formed in the under-pipe supporting plate in the vertical direction at intervals, the inverted filter layer and the under-pipe supporting plate are sequentially arranged above the filling material, and the filling material pouring holes extend from the upper top surfaces of the cover plate pitch side walls to the bottoms of the cover plate pitch side walls and the portions, where the filling materialis located, on the inner side surfaces of the cover plate pitch side walls. The adjusting method uses the cover plate ditch, and adjustment of differential settlement of the buried pipe is achieved bypouring a mixture of the filling material and water into an original filling material position below the buried pipe; and according to the cover plate ditch and the adjusting method, damage caused bydifferential settlement of the buried pipe can be avoided, and the operation and maintenance cost of the buried pipe is greatly reduced.
本发明公开了一种可对埋管不均匀沉降进行调节的盖板沟及调节方法,涉及软土地基处理领域。该盖板沟包括:盖板沟侧墙、盖板沟底板、盖板、管下支承板、填充料灌注孔、填充料、反滤层以及灌注孔孔盖;所述盖板沟侧墙上沿竖向间隔地设置有填充料灌注孔;所述管下支承板上沿竖向间隔地设置有支承板预留孔;所述填充料上方依次布置有反滤层、管下支承板;所述填充料灌注孔由盖板沟侧墙上顶面延伸至盖板沟侧墙底部、填充料所在位置处盖板沟侧墙的内侧面处。所述调节方法应用所述盖板沟,通过对埋管下原填充料位置灌注填充料与水的混合物来实现对埋管不均匀沉降的调节。本发明可避免埋管发生不均匀沉降进而发生破坏,使埋管运维成本大幅降低。
Cover plate ditch capable of adjusting differential settlement of buried pipe and adjusting method
The invention discloses a cover plate ditch capable of adjusting differential settlement of a buried pipe and an adjusting method, and relates to the field of soft soil foundation treatment. The coverplate ditch comprises cover plate ditch side walls, a cover plate ditch bottom plate, a cover plate, an under-pipe supporting plate, filling material pouring holes, a filling material, an inverted filter layer and a pouring hole cover, the filling material pouring holes are formed in the cover plate ditch side walls in the vertical direction at intervals, supporting plate preformed holes are formed in the under-pipe supporting plate in the vertical direction at intervals, the inverted filter layer and the under-pipe supporting plate are sequentially arranged above the filling material, and the filling material pouring holes extend from the upper top surfaces of the cover plate pitch side walls to the bottoms of the cover plate pitch side walls and the portions, where the filling materialis located, on the inner side surfaces of the cover plate pitch side walls. The adjusting method uses the cover plate ditch, and adjustment of differential settlement of the buried pipe is achieved bypouring a mixture of the filling material and water into an original filling material position below the buried pipe; and according to the cover plate ditch and the adjusting method, damage caused bydifferential settlement of the buried pipe can be avoided, and the operation and maintenance cost of the buried pipe is greatly reduced.
本发明公开了一种可对埋管不均匀沉降进行调节的盖板沟及调节方法,涉及软土地基处理领域。该盖板沟包括:盖板沟侧墙、盖板沟底板、盖板、管下支承板、填充料灌注孔、填充料、反滤层以及灌注孔孔盖;所述盖板沟侧墙上沿竖向间隔地设置有填充料灌注孔;所述管下支承板上沿竖向间隔地设置有支承板预留孔;所述填充料上方依次布置有反滤层、管下支承板;所述填充料灌注孔由盖板沟侧墙上顶面延伸至盖板沟侧墙底部、填充料所在位置处盖板沟侧墙的内侧面处。所述调节方法应用所述盖板沟,通过对埋管下原填充料位置灌注填充料与水的混合物来实现对埋管不均匀沉降的调节。本发明可避免埋管发生不均匀沉降进而发生破坏,使埋管运维成本大幅降低。
Cover plate ditch capable of adjusting differential settlement of buried pipe and adjusting method
一种可对埋管不均匀沉降进行调节的盖板沟及调节方法
MA JUNWEI (Autor:in) / WU FANGHUA (Autor:in) / WANG LEI (Autor:in)
11.08.2020
Patent
Elektronische Ressource
Chinesisch
IPC:
E02D
FOUNDATIONS
,
Gründungen
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