Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Ceramic conductive material and preparation method thereof
The invention provides a ceramic conductive material and a preparation method thereof. The ceramic conductive material comprises a ceramic matrix and a metallization layer formed on the surface of theceramic matrix, wherein the metallization layer comprises a chemical copper plating layer, an electrocoppering layer, an electrotinning layer and a tin protection layer which are sequentially arranged from inside to outside, the thickness of the chemical copper plating layer is 0.5-1 [mu]m, the thickness of the electrocoppering layer is 5-10 [mu]m, and the thickness of the electrotinning layer is2-3 [mu]m. According to the invention, stable chemical bonds are formed between copper and the surface of the ceramic matrix through a high-temperature chemical reaction, so that the copper is firmlycombined with the ceramic matrix, and the binding force between the plating layer and the ceramic is increased; and the conductive treatment of the ceramic surface can be realized.
本发明提供了一种陶瓷导电材料及其制备方法，所述陶瓷导电材料包括陶瓷基体以及形成在所述陶瓷基体表面的金属化层，其特征在于：所述金属化层包括由内向外依次设置的化学镀铜层、电镀铜层、电镀锡层和锡保护层；所述化学镀铜层的厚度为0.5μm‑1μm，所述电镀铜层的厚度为5μm‑10μm，所述电镀锡层的厚度为2μm‑3μm。通过高温化学反应使铜与陶瓷基体表面形成稳定的化学键，使其与陶瓷基体牢固结合，增加了镀层与陶瓷的结合力；同时可以实现陶瓷表面的导电化处理。
Ceramic conductive material and preparation method thereof
The invention provides a ceramic conductive material and a preparation method thereof. The ceramic conductive material comprises a ceramic matrix and a metallization layer formed on the surface of theceramic matrix, wherein the metallization layer comprises a chemical copper plating layer, an electrocoppering layer, an electrotinning layer and a tin protection layer which are sequentially arranged from inside to outside, the thickness of the chemical copper plating layer is 0.5-1 [mu]m, the thickness of the electrocoppering layer is 5-10 [mu]m, and the thickness of the electrotinning layer is2-3 [mu]m. According to the invention, stable chemical bonds are formed between copper and the surface of the ceramic matrix through a high-temperature chemical reaction, so that the copper is firmlycombined with the ceramic matrix, and the binding force between the plating layer and the ceramic is increased; and the conductive treatment of the ceramic surface can be realized.
本发明提供了一种陶瓷导电材料及其制备方法，所述陶瓷导电材料包括陶瓷基体以及形成在所述陶瓷基体表面的金属化层，其特征在于：所述金属化层包括由内向外依次设置的化学镀铜层、电镀铜层、电镀锡层和锡保护层；所述化学镀铜层的厚度为0.5μm‑1μm，所述电镀铜层的厚度为5μm‑10μm，所述电镀锡层的厚度为2μm‑3μm。通过高温化学反应使铜与陶瓷基体表面形成稳定的化学键，使其与陶瓷基体牢固结合，增加了镀层与陶瓷的结合力；同时可以实现陶瓷表面的导电化处理。
Ceramic conductive material and preparation method thereof
一种陶瓷导电材料及其制备方法
HU XIN (Autor:in) / QU YUANPING (Autor:in) / ZHANG HONGYAN (Autor:in)
08.09.2020
Patent
Elektronische Ressource
Chinesisch
Conductive ceramic material and preparation method thereof
| Europäisches Patentamt | 2015
Conductive ceramic material and preparation method thereof
| Europäisches Patentamt | 2016
Ceramic conductive material and preparation method and application thereof
| Europäisches Patentamt | 2020
Heat-resisting conductive ceramic material and preparation method thereof
| Europäisches Patentamt | 2015