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Convenient high-sealing and high-temperature-resistant packaging method
The invention relates to a convenient high-sealing high-temperature-resistant packaging method. The method comprises the following steps: coating glue on the edge of a tube shell, reserving an air escape hole; covering the tube shell with glass by using a loading machine, releasing the glass when the glass is about to be in contact with the glue, so that the glass naturally falls and a workpiece Iis obtained; heating the workpiece I to improve the flowability of glue in the workpiece I so as to close the air escape hole to obtain a workpiece II, wherein in the closing process of the air escape hole, gas in the cavity is heated to expand, and part of gas escapes from the air escape hole; placing the workpiece II in an environment with a room temperature so as to cool and shrink the gas inthe workpiece II, and forming a negative pressure in a cavity between the glass in the workpiece II and the tube shell; curing the UV glue, and degassing and baking the workpiece II to remove water vapor in the workpiece II. The sealing performance of the product is effectively improved, the product can pass subsequent reflow soldering at the highest temperature of 260 DEG C, the product can meetthe higher reliability requirements, solder with a higher melting point can be used during reflow soldering, the air escape hole can be automatically closed without later filling, the packaging time is shortened by 20 minutes, and the production efficiency is improved.
本发明涉及一种便捷高密封耐高温的封装方法,包括以下步骤:在管壳的边缘涂布胶水,预留逃气孔;使用上片机将玻璃封盖到管壳上,在玻璃与胶水即将接触时释放玻璃,使玻璃自然下落得到工件一;加热工件一以提高工件一中的胶水的流动性,从而闭合逃气孔得到工件二,在逃气孔闭合过程中,腔体内部气体受热膨胀,部分气体从逃气孔跑出;将工件二室温放置以使其内部气体冷却收缩,工件二中的玻璃与管壳之间的腔体形成负压;UV胶固化,并对工件二进行除气烘烤以将工件二中的水汽排除;本发明有效提高产品的密封性,可使产品通过后续最高260℃的回流焊,产品能够通过更高的可靠度要求,在过回流焊时可以使用熔点更高的焊料,逃气孔不需后期填补即可自动闭合,封装时间缩减20min,提高生产效率。
Convenient high-sealing and high-temperature-resistant packaging method
The invention relates to a convenient high-sealing high-temperature-resistant packaging method. The method comprises the following steps: coating glue on the edge of a tube shell, reserving an air escape hole; covering the tube shell with glass by using a loading machine, releasing the glass when the glass is about to be in contact with the glue, so that the glass naturally falls and a workpiece Iis obtained; heating the workpiece I to improve the flowability of glue in the workpiece I so as to close the air escape hole to obtain a workpiece II, wherein in the closing process of the air escape hole, gas in the cavity is heated to expand, and part of gas escapes from the air escape hole; placing the workpiece II in an environment with a room temperature so as to cool and shrink the gas inthe workpiece II, and forming a negative pressure in a cavity between the glass in the workpiece II and the tube shell; curing the UV glue, and degassing and baking the workpiece II to remove water vapor in the workpiece II. The sealing performance of the product is effectively improved, the product can pass subsequent reflow soldering at the highest temperature of 260 DEG C, the product can meetthe higher reliability requirements, solder with a higher melting point can be used during reflow soldering, the air escape hole can be automatically closed without later filling, the packaging time is shortened by 20 minutes, and the production efficiency is improved.
本发明涉及一种便捷高密封耐高温的封装方法,包括以下步骤:在管壳的边缘涂布胶水,预留逃气孔;使用上片机将玻璃封盖到管壳上,在玻璃与胶水即将接触时释放玻璃,使玻璃自然下落得到工件一;加热工件一以提高工件一中的胶水的流动性,从而闭合逃气孔得到工件二,在逃气孔闭合过程中,腔体内部气体受热膨胀,部分气体从逃气孔跑出;将工件二室温放置以使其内部气体冷却收缩,工件二中的玻璃与管壳之间的腔体形成负压;UV胶固化,并对工件二进行除气烘烤以将工件二中的水汽排除;本发明有效提高产品的密封性,可使产品通过后续最高260℃的回流焊,产品能够通过更高的可靠度要求,在过回流焊时可以使用熔点更高的焊料,逃气孔不需后期填补即可自动闭合,封装时间缩减20min,提高生产效率。
Convenient high-sealing and high-temperature-resistant packaging method
一种便捷高密封耐高温的封装方法
YOU CHAO (Autor:in) / ZHOU XUEFENG (Autor:in)
18.09.2020
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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