Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Composite thermal insulation wallboard and preparation method
The invention discloses a composite thermal insulation wallboard. The composite thermal insulation wallboard includes an outer board and an inner board. The outer board is a light-weight thermal insulation composite outer board which is formed by combining a cement-based large-cavity wallboard cavity with an inorganic thermal insulation material core body, the thickness is 90-150mm, wherein the hollow ratio of a cement-based large cavity body is >=70%, and the cement-based large cavity body is prepared from a fiber-reinforced cement-based composite material through a grouting and extrusion process; and the inner board is a lightweight aggregate concrete inner board with a thickness of 200-240 mm. The invention further discloses a preparation method of the composite thermal insulation wallboard. The prepared composite thermal insulation wallboard has a total heat transfer coefficient of 0.3-1.0W/(m<2>.k), and can be applied to the thermal insulation and energy saving requirements of various types of buildings in different regions and different climates, and meanwhile, the weight of the prepared composite thermal insulation wallboard is only 50-60% of an ordinary structural thermal insulation wallboard, so that the weight of a wallboard structure is greatly reduced.
本发明公开了一种复合保温墙板，所述的一种复合保温墙板包括外叶板和内叶板，外叶板为轻质保温复合外叶板，由水泥基大空腔墙板腔体和无机保温材料芯体复合而成，厚度为90～150mm，其中水泥基大空腔腔体空心率≥70％，采用纤维增强水泥基复合材料，通过注浆挤压工艺制备而成；内叶板为轻骨料混凝土内叶板，厚度200‑240mm，本发明还公开了一种复合保温墙板的制备方法。所制备的复合保温墙板总传热系数0.3‑1.0W/(m2·k)，可适用于不同地区、不同气候环境下多样化类型建筑的保温节能需求，同时其重量仅为普通结构保温墙板的50‑60％，极大降低了墙板结构自重。
Composite thermal insulation wallboard and preparation method
The invention discloses a composite thermal insulation wallboard. The composite thermal insulation wallboard includes an outer board and an inner board. The outer board is a light-weight thermal insulation composite outer board which is formed by combining a cement-based large-cavity wallboard cavity with an inorganic thermal insulation material core body, the thickness is 90-150mm, wherein the hollow ratio of a cement-based large cavity body is >=70%, and the cement-based large cavity body is prepared from a fiber-reinforced cement-based composite material through a grouting and extrusion process; and the inner board is a lightweight aggregate concrete inner board with a thickness of 200-240 mm. The invention further discloses a preparation method of the composite thermal insulation wallboard. The prepared composite thermal insulation wallboard has a total heat transfer coefficient of 0.3-1.0W/(m<2>.k), and can be applied to the thermal insulation and energy saving requirements of various types of buildings in different regions and different climates, and meanwhile, the weight of the prepared composite thermal insulation wallboard is only 50-60% of an ordinary structural thermal insulation wallboard, so that the weight of a wallboard structure is greatly reduced.
本发明公开了一种复合保温墙板，所述的一种复合保温墙板包括外叶板和内叶板，外叶板为轻质保温复合外叶板，由水泥基大空腔墙板腔体和无机保温材料芯体复合而成，厚度为90～150mm，其中水泥基大空腔腔体空心率≥70％，采用纤维增强水泥基复合材料，通过注浆挤压工艺制备而成；内叶板为轻骨料混凝土内叶板，厚度200‑240mm，本发明还公开了一种复合保温墙板的制备方法。所制备的复合保温墙板总传热系数0.3‑1.0W/(m2·k)，可适用于不同地区、不同气候环境下多样化类型建筑的保温节能需求，同时其重量仅为普通结构保温墙板的50‑60％，极大降低了墙板结构自重。
Composite thermal insulation wallboard and preparation method
一种复合保温墙板及制备方法
GAO YUXIN (Autor:in) / CHENG BAOJUN (Autor:in) / YANG WEN (Autor:in) / WANG JUN (Autor:in) / YU BAOYING (Autor:in) / MA PENGFEI (Autor:in) / TU YULIN (Autor:in) / KANG SHENGRONG (Autor:in) / LI SHUANG (Autor:in)
30.10.2020
Patent
Elektronische Ressource
Chinesisch
IPC:
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
/
C04B
Kalk
,
LIME
/
E04C
STRUCTURAL ELEMENTS
,
Bauelemente
| Europäisches Patentamt | 2020
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