Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
High-heat-conduction type heating floor and laying and wiring system thereof
The invention relates to a high-heat-conduction type heating floor and a laying and wiring system thereof, and belongs to the field of heating floors. The high-heat-conduction type heating floor comprises a laying bottom plate, a brick plate body and an electric heating wire, wherein the laying bottom plate comprises a base plate and a sealing plate, the sealing plate and the base plate are combined to form a grouting cavity, and the side, away from the base plate, of the sealing plate is provided with bonding holes. The brick plate body is installed on the surface of the sealing plate, the part, without the bonding holes, of the sealing plate sinks towards the base plate to form a laying groove, and the electric heating wire is laid in the laying groove. The brick plate body can be directly heated after the electric heating wire is powered on, the heat transfer distance between the brick plate body and the external environment is reduced, the heat transfer efficiency is improved accordingly, meanwhile, a base material is synchronously heated, the heat storage and heat preservation effects are achieved, meanwhile, an embedded male plug connector is adopted for wiring, and wiring work is facilitated.
本申请涉及一种高热传导型地暖地板及其铺装接线系统，属于地暖地板领域，其包括铺装底板、砖板本体和电加热线，所述铺装底板包括基板和封板，所述封板与基板结合形成有灌浆腔室，所述封板远离基板的一侧开设有粘结孔，所述砖板本体安装于封板表面，所述封板未设有粘接孔的部分朝向基板凹陷形成有铺设槽，所述电加热线铺设于铺设槽内。本申请中电加热线通电后可直接给砖块本体进行加热，减小了与外界环境热传递的距离，从而提高了传热效率，同时基材也在同步加热，具有储热保温的效果，同时采用预埋公插接头进行接线，还方便了接线工作。
High-heat-conduction type heating floor and laying and wiring system thereof
The invention relates to a high-heat-conduction type heating floor and a laying and wiring system thereof, and belongs to the field of heating floors. The high-heat-conduction type heating floor comprises a laying bottom plate, a brick plate body and an electric heating wire, wherein the laying bottom plate comprises a base plate and a sealing plate, the sealing plate and the base plate are combined to form a grouting cavity, and the side, away from the base plate, of the sealing plate is provided with bonding holes. The brick plate body is installed on the surface of the sealing plate, the part, without the bonding holes, of the sealing plate sinks towards the base plate to form a laying groove, and the electric heating wire is laid in the laying groove. The brick plate body can be directly heated after the electric heating wire is powered on, the heat transfer distance between the brick plate body and the external environment is reduced, the heat transfer efficiency is improved accordingly, meanwhile, a base material is synchronously heated, the heat storage and heat preservation effects are achieved, meanwhile, an embedded male plug connector is adopted for wiring, and wiring work is facilitated.
本申请涉及一种高热传导型地暖地板及其铺装接线系统，属于地暖地板领域，其包括铺装底板、砖板本体和电加热线，所述铺装底板包括基板和封板，所述封板与基板结合形成有灌浆腔室，所述封板远离基板的一侧开设有粘结孔，所述砖板本体安装于封板表面，所述封板未设有粘接孔的部分朝向基板凹陷形成有铺设槽，所述电加热线铺设于铺设槽内。本申请中电加热线通电后可直接给砖块本体进行加热，减小了与外界环境热传递的距离，从而提高了传热效率，同时基材也在同步加热，具有储热保温的效果，同时采用预埋公插接头进行接线，还方便了接线工作。
High-heat-conduction type heating floor and laying and wiring system thereof
一种高热传导型地暖地板及其铺装接线系统
CHEN XIAOFEI (Autor:in)
17.11.2020
Patent
Elektronische Ressource
Chinesisch
IPC:
F24D
DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS
,
Haus- oder Raumheizungssysteme, z.B. Zentralheizungssysteme
/
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
/
H01R
Elektrisch leitende Verbindungen
,
ELECTRICALLY-CONDUCTIVE CONNECTIONS
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