Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The invention discloses a novel filling floor system, and relates to the technical field of buildings. The novel filling floor system comprises a plurality of modules, wherein each module comprises atop plate, bottom plates and connecting plates; the bottom plates are arranged in parallel to the top plate at intervals; the connecting plates are fixedly connected between the top plate and the bottom plates; the modules are arranged in parallel side by side; any two adjacent bottom plates can be detachably butted; spaces for concrete to enter are respectively arranged between the two adjacent top plates and between the two adjacent connecting plates; and one end, near the bottom plates, of each connecting plate is provided with a through hole for a profile plate to penetrate through. The novel filling floor system solves the problems of complicated construction process, low construction efficiency, high construction cost and uneven bottom of the building floor system in the prior art.
本发明公开了新型填充楼盖,涉及建筑技术领域。包括多个模块,各个模块均包括顶板、与顶板平行间隔设置的底板以及固定连接在顶板与底板之间的连接板,各个模块平行并排设置,并且任意相邻的两个底板之间能够可拆卸对接,相邻的两个顶板之间以及相邻的两个连接板之间均设置有用于供混凝土进行进入的间距,连接板在靠近底板的一端设置有用于供型材板进行贯穿的通孔;从而解决了现有技术中建筑楼盖的施工工艺复杂、施工效率低下、施工造价高以及楼盖的底部不平整的问题。
The invention discloses a novel filling floor system, and relates to the technical field of buildings. The novel filling floor system comprises a plurality of modules, wherein each module comprises atop plate, bottom plates and connecting plates; the bottom plates are arranged in parallel to the top plate at intervals; the connecting plates are fixedly connected between the top plate and the bottom plates; the modules are arranged in parallel side by side; any two adjacent bottom plates can be detachably butted; spaces for concrete to enter are respectively arranged between the two adjacent top plates and between the two adjacent connecting plates; and one end, near the bottom plates, of each connecting plate is provided with a through hole for a profile plate to penetrate through. The novel filling floor system solves the problems of complicated construction process, low construction efficiency, high construction cost and uneven bottom of the building floor system in the prior art.
本发明公开了新型填充楼盖,涉及建筑技术领域。包括多个模块,各个模块均包括顶板、与顶板平行间隔设置的底板以及固定连接在顶板与底板之间的连接板,各个模块平行并排设置,并且任意相邻的两个底板之间能够可拆卸对接,相邻的两个顶板之间以及相邻的两个连接板之间均设置有用于供混凝土进行进入的间距,连接板在靠近底板的一端设置有用于供型材板进行贯穿的通孔;从而解决了现有技术中建筑楼盖的施工工艺复杂、施工效率低下、施工造价高以及楼盖的底部不平整的问题。
Novel filling floor system
新型填充楼盖
15.12.2020
Patent
Elektronische Ressource
Chinesisch
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
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