Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The invention relates to a heat-conducting profile floor. The floor comprises a bottom plate laid on the ground and a panel matching the bottom plate and covering the bottom plate, combination parts connected to the adjacent bottom plate or panel are arranged at the two ends of the bottom plate or panel, the bottom plate and the panel are connected in an inserted mode through a plurality of pairsof mortises and tenons, a plurality of parallel heat conduction pipe grooves are formed in the panel in a length direction, heat pipes are placed in the heat conduction pipe grooves, the evaporation ends of the heat pipes are heated by a skirting line plate heating device arranged on the wall surface, and the condensation ends of the heat pipes are in butt joint with the evaporation ends of the heat pipes of the adjacent panel. The heat pipes are adopted as passive heat transfer elements, the heat pipes have efficient heat conductivity and temperature uniformity, heat emitted by the skirting line plate heating device can be rapidly transferred to each place of a room, a temperature rise speed is high, the heat transfer efficiency is high, the defect that a traditional floor heating mode isvery slow in temperature rise is overcome, and energy consumption is greatly reduced.
本发明涉及一种导热的型材地板，包括铺设在地面的底板，与底板配合并覆盖底板的面板，所述底板或面板两端设有与相邻底板或面板连接的结合部，所述底板和面板之间通过若干对榫卯插接，所述面板沿长度方向设有若干条平行导热管槽，导热管槽内放置热管，热管蒸发端受热于设在墙面的踢脚线板发热装置，冷凝端与相邻面板的热管蒸发端对接；采用热管作为被动传热元件，热管具有高效导热性及均温性，能迅速将踢脚线板发热装置散发的热量传递到房间的每个地方，升温速度快，传热效率高，克服了传统的地板采暖方式升温十分缓慢的弊端，大大节省了能源消耗。
The invention relates to a heat-conducting profile floor. The floor comprises a bottom plate laid on the ground and a panel matching the bottom plate and covering the bottom plate, combination parts connected to the adjacent bottom plate or panel are arranged at the two ends of the bottom plate or panel, the bottom plate and the panel are connected in an inserted mode through a plurality of pairsof mortises and tenons, a plurality of parallel heat conduction pipe grooves are formed in the panel in a length direction, heat pipes are placed in the heat conduction pipe grooves, the evaporation ends of the heat pipes are heated by a skirting line plate heating device arranged on the wall surface, and the condensation ends of the heat pipes are in butt joint with the evaporation ends of the heat pipes of the adjacent panel. The heat pipes are adopted as passive heat transfer elements, the heat pipes have efficient heat conductivity and temperature uniformity, heat emitted by the skirting line plate heating device can be rapidly transferred to each place of a room, a temperature rise speed is high, the heat transfer efficiency is high, the defect that a traditional floor heating mode isvery slow in temperature rise is overcome, and energy consumption is greatly reduced.
本发明涉及一种导热的型材地板，包括铺设在地面的底板，与底板配合并覆盖底板的面板，所述底板或面板两端设有与相邻底板或面板连接的结合部，所述底板和面板之间通过若干对榫卯插接，所述面板沿长度方向设有若干条平行导热管槽，导热管槽内放置热管，热管蒸发端受热于设在墙面的踢脚线板发热装置，冷凝端与相邻面板的热管蒸发端对接；采用热管作为被动传热元件，热管具有高效导热性及均温性，能迅速将踢脚线板发热装置散发的热量传递到房间的每个地方，升温速度快，传热效率高，克服了传统的地板采暖方式升温十分缓慢的弊端，大大节省了能源消耗。
Heat-conducting profile floor
一种导热的型材地板
WANG XU (Autor:in)
12.01.2021
Patent
Elektronische Ressource
Chinesisch
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
/
F28D
Wärmetauscher, soweit in keiner anderen Unterklasse vorgesehen, in denen die Wärmetauschmittel nicht in direkte Berührung miteinander kommen
,
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
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