Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermal sensitive ceramic chip, and thermistor and preparation method thereof
The invention relates to a thermal sensitive ceramic chip, and a thermistor and a preparation method thereof. The thermal sensitive ceramic chip is formed by mixing metal oxide powder by adopting a solid-phase synthesis method and sintering at a high temperature, wherein the metal oxide powder comprises the following components in percentage by mass: 40-47% of manganese dioxide, 50-56% of cobaltosic oxide, 2-5% of copper oxide and 1-4% of titanium dioxide. The thermistor prepared by the invention has a low resistance value R25 and a high B value, and the strength and stability of the materialare obviously improved.
一种热敏陶瓷片、热敏电阻及其制备方法，所述热敏陶瓷片是由金属氧化物粉末采用固相合成法混合后经过高温烧结成的热敏陶瓷片，所述金属氧化物粉末包括如下组分，按照质量百分比计算：40％‑47％的二氧化锰，50％‑56％的四氧化三钴，2％‑5％的氧化铜，以及1％‑4％的二氧化钛。本发明制得的热敏电阻不仅具有低电阻值R25和高B值，而且在材料的强度及稳定性上有明显提升。
Thermal sensitive ceramic chip, and thermistor and preparation method thereof
The invention relates to a thermal sensitive ceramic chip, and a thermistor and a preparation method thereof. The thermal sensitive ceramic chip is formed by mixing metal oxide powder by adopting a solid-phase synthesis method and sintering at a high temperature, wherein the metal oxide powder comprises the following components in percentage by mass: 40-47% of manganese dioxide, 50-56% of cobaltosic oxide, 2-5% of copper oxide and 1-4% of titanium dioxide. The thermistor prepared by the invention has a low resistance value R25 and a high B value, and the strength and stability of the materialare obviously improved.
一种热敏陶瓷片、热敏电阻及其制备方法，所述热敏陶瓷片是由金属氧化物粉末采用固相合成法混合后经过高温烧结成的热敏陶瓷片，所述金属氧化物粉末包括如下组分，按照质量百分比计算：40％‑47％的二氧化锰，50％‑56％的四氧化三钴，2％‑5％的氧化铜，以及1％‑4％的二氧化钛。本发明制得的热敏电阻不仅具有低电阻值R25和高B值，而且在材料的强度及稳定性上有明显提升。
Thermal sensitive ceramic chip, and thermistor and preparation method thereof
一种热敏陶瓷片、热敏电阻及其制备方法
HUANG FEI (Autor:in) / WANG QINGHUA (Autor:in) / YAO BIN (Autor:in) / HUANG XIONG (Autor:in)
26.01.2021
Patent
Elektronische Ressource
Chinesisch
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