Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The invention relates to a binder, a ceramic structural member, a corresponding preparation method thereof and electronic equipment, and the binder comprises the following components in percentage bymass: 12%-17% of polypropylene, 15%-20% of polyethylene, 60%-65% of paraffin, 2%-5% of stearic acid and 4%-6% of dibutyl phthalate. In the ceramic injection molding process of the binder and the ceramic powder of the components, the binder can better bind the ceramic powder without generating ceramic powder agglomeration, so that poor fluidity caused by too large granularity of the ceramic powderis avoided, separation and agglomeration of the ceramic powder and the binder in the ceramic injection molding process are avoided, and generation of high porosity, large pores and low strength is avoided.
本申请涉及一种粘结剂、陶瓷结构件及其相应的制备方法和电子设备，按照质量百分含量计，所述粘结剂包括如下组分：12％～17％的聚丙烯、15％～20％的聚乙烯、60％～65％的石蜡、2％～5％的硬脂酸和4％～6％的邻苯二甲酸二丁酯。上述组分的粘结剂与陶瓷粉体在陶瓷注射成型过程中，粘结剂能够更好的粘结陶瓷粉体，而不会产生陶瓷粉体团聚的情况，从而避免由于陶瓷粉体粒度太大而导致流动性太差，而在陶瓷注射成型过程中陶瓷粉体与粘结剂分离团聚，以至于产生气孔率高、气孔大、强度低的情况。
The invention relates to a binder, a ceramic structural member, a corresponding preparation method thereof and electronic equipment, and the binder comprises the following components in percentage bymass: 12%-17% of polypropylene, 15%-20% of polyethylene, 60%-65% of paraffin, 2%-5% of stearic acid and 4%-6% of dibutyl phthalate. In the ceramic injection molding process of the binder and the ceramic powder of the components, the binder can better bind the ceramic powder without generating ceramic powder agglomeration, so that poor fluidity caused by too large granularity of the ceramic powderis avoided, separation and agglomeration of the ceramic powder and the binder in the ceramic injection molding process are avoided, and generation of high porosity, large pores and low strength is avoided.
本申请涉及一种粘结剂、陶瓷结构件及其相应的制备方法和电子设备，按照质量百分含量计，所述粘结剂包括如下组分：12％～17％的聚丙烯、15％～20％的聚乙烯、60％～65％的石蜡、2％～5％的硬脂酸和4％～6％的邻苯二甲酸二丁酯。上述组分的粘结剂与陶瓷粉体在陶瓷注射成型过程中，粘结剂能够更好的粘结陶瓷粉体，而不会产生陶瓷粉体团聚的情况，从而避免由于陶瓷粉体粒度太大而导致流动性太差，而在陶瓷注射成型过程中陶瓷粉体与粘结剂分离团聚，以至于产生气孔率高、气孔大、强度低的情况。
Binder, ceramic structural part, corresponding preparation method of ceramic structural part and electronic equipment
粘结剂、陶瓷结构件及其相应的制备方法和电子设备
LI JIE (Autor:in)
09.02.2021
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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