Microwave dielectric ceramic material and preparation method thereof: Fid-Bau Portal

Microwave dielectric ceramic material and preparation method thereof

HUANG QINGHUAN / LI LI / WANG BINHUA / LIANG XIAOJIAN / XU HAIXIN

The invention provides a microwave dielectric ceramic material. The microwave dielectric ceramic material comprises a ceramic main material and a modified additive, wherein the addition amount of the modified additive accounts for 1-4% of the total mass of the ceramic main material; and the ceramic main materials comprise a first ceramic main material, a second ceramic main material and a third ceramic main material, wherein the first ceramic main material is MgTiO3 and/or Mg2TiO4, the second ceramic main material is (Mg1/2Zn1/2) Al2O4 and/or (Mg1/2Co1/2) Al2O4, and the third ceramic main material is CaTiO3. The microwave dielectric ceramic material of an MgTiO3-CaTiO3-MgAl2O4 system is formed by introducing (Mg1/2Zn1/2) Al2O4 and/or (Mg1/2Co1/2) Al2O4 with good thermal shock resistance, so that the thermal shock resistance of the material is greatly improved; the prepared microwave dielectric ceramic material has excellent performance; under the condition that the dielectric constant of the microwave dielectric ceramic material is kept about 20, the quality factor of the microwave dielectric ceramic material is relatively high, and the temperature coefficient of resonance frequency of the microwave dielectric ceramic is close to zero; and meanwhile, the thermal shock temperature difference of the microwave dielectric ceramic is 90-95 DEG C, and the microwave dielectric ceramic has high thermal shock resistance and can well meet the requirements of 5G mobile communication application.

本发明提供了一种微波介质陶瓷材料，其包括陶瓷主料和添加量占所述陶瓷主料的总质量的1％～4％的改性添加剂；其中，所述陶瓷主料包括第一陶瓷主料、第二陶瓷主料和第三陶瓷主料，所述第一陶瓷主料为MgTiO3和/或Mg2TiO4，所述第二陶瓷主料为(Mg1/2Zn1/2)Al2O4和/或(Mg1/2Co1/2)Al2O4，所述第三陶瓷主料为CaTiO3。本发明通过引入具有良好抗热震性的(Mg1/2Zn1/2)Al2O4和/或(Mg1/2Co1/2)Al2O4，形成MgTiO3‑CaTiO3‑MgAl2O4体系的微波介质陶瓷材料，从而大幅度提高了材料的抗热震性能，所制备获得的微波介质陶瓷材料具有优异的性能，其介电常数在保持20左右的情况下，品质因数较高，谐振频率温度系数接近于零，同时该微波介质陶瓷热震温差为90℃～95℃，具有较高的抗热震性，能够较好满足5G移动通信应用的需求。

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