Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
JOINED BODY AND SURFACE ACOUSTIC WAVE DEVICE
This joined body is provided with a piezoelectric substrate and a spinel polycrystalline substrate provided on one primary surface of the piezoelectric substrate, and the spinel polycrystalline substrate has a porosity of 0.005% to 0.6%.
提供一种接合体，该接合体包括压电体基板以及设置在所述压电体基板的一个主面上的尖晶石多晶基板，其中，所述尖晶石多晶基板的孔隙率为0.005％以上0.6％以下。
JOINED BODY AND SURFACE ACOUSTIC WAVE DEVICE
This joined body is provided with a piezoelectric substrate and a spinel polycrystalline substrate provided on one primary surface of the piezoelectric substrate, and the spinel polycrystalline substrate has a porosity of 0.005% to 0.6%.
提供一种接合体，该接合体包括压电体基板以及设置在所述压电体基板的一个主面上的尖晶石多晶基板，其中，所述尖晶石多晶基板的孔隙率为0.005％以上0.6％以下。
JOINED BODY AND SURFACE ACOUSTIC WAVE DEVICE
接合体及表面弹性波器件
SAITO HIROHISA (Autor:in) / NAKAYAMA SHIGERU (Autor:in) / IMAGAWA YOSHIHIRO (Autor:in) / GESHI KEIICHIRO (Autor:in) / YAMANAKA YUICHIRO (Autor:in)
24.08.2021
Patent
Elektronische Ressource
Chinesisch