Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Energy-saving intelligent heat dissipation fabricated building component with built-in chip
The invention discloses an energy-saving intelligent heat dissipation fabricated building component with a built-in chip. The energy-saving intelligent heat dissipation fabricated building component comprises a component main body, a mounting frame, a cover plate, the chip and a mounting shell; a mounting groove is formed in the surface of the component main body; the mounting frame is embedded in the mounting groove; the mounting frame is of a hollow structure; an opening is formed in one side of the mounting frame; the opening and a groove opening of the mounting groove face the same direction; the cover plate is detachably arranged at the opening of the mounting frame in a sealed mode; a sealed mounting space is defined by the cover plate and the mounting frame; the chip is arranged in the mounting shell; and the mounting shell is detachably arranged in the mounting space. When the chip needs to be replaced, only the cover plate needs to be detached from the opening of the mounting frame, and then the mounting shell is taken out of the mounting frame for chip replacement. In the operation process, close fit between the mounting frame and a construction body is not damaged, and therefore the situation that the mounting frame can be stably embedded in the construction body can be guaranteed.
本发明公开了一种内置芯片节能智能散热的装配式建筑构件，包括：构件主体，所述构件主体表面设置有安装槽；安装框，所述安装框嵌设于所述安装槽内，所述安装框为中空结构，且一侧设置有开口，所述开口与所述安装槽的槽口具有相同朝向；盖板，所述盖板可拆卸的密封式配置于所述安装框的开口处，与所述安装框围成密封的安装空间；芯片与安装壳，所述芯片设置于所述安装壳内，所述安装壳可拆卸的配置于所述安装空间内。当需要更换芯片时，只需要将盖板从安装框的开口上拆下，再将安装壳从安装框内取出更换即可；该操作过程中，不会破坏安装框与构建主体之间的紧密配合，从而可保证安装框能够稳定嵌设在构件主体内。
Energy-saving intelligent heat dissipation fabricated building component with built-in chip
The invention discloses an energy-saving intelligent heat dissipation fabricated building component with a built-in chip. The energy-saving intelligent heat dissipation fabricated building component comprises a component main body, a mounting frame, a cover plate, the chip and a mounting shell; a mounting groove is formed in the surface of the component main body; the mounting frame is embedded in the mounting groove; the mounting frame is of a hollow structure; an opening is formed in one side of the mounting frame; the opening and a groove opening of the mounting groove face the same direction; the cover plate is detachably arranged at the opening of the mounting frame in a sealed mode; a sealed mounting space is defined by the cover plate and the mounting frame; the chip is arranged in the mounting shell; and the mounting shell is detachably arranged in the mounting space. When the chip needs to be replaced, only the cover plate needs to be detached from the opening of the mounting frame, and then the mounting shell is taken out of the mounting frame for chip replacement. In the operation process, close fit between the mounting frame and a construction body is not damaged, and therefore the situation that the mounting frame can be stably embedded in the construction body can be guaranteed.
本发明公开了一种内置芯片节能智能散热的装配式建筑构件，包括：构件主体，所述构件主体表面设置有安装槽；安装框，所述安装框嵌设于所述安装槽内，所述安装框为中空结构，且一侧设置有开口，所述开口与所述安装槽的槽口具有相同朝向；盖板，所述盖板可拆卸的密封式配置于所述安装框的开口处，与所述安装框围成密封的安装空间；芯片与安装壳，所述芯片设置于所述安装壳内，所述安装壳可拆卸的配置于所述安装空间内。当需要更换芯片时，只需要将盖板从安装框的开口上拆下，再将安装壳从安装框内取出更换即可；该操作过程中，不会破坏安装框与构建主体之间的紧密配合，从而可保证安装框能够稳定嵌设在构件主体内。
Energy-saving intelligent heat dissipation fabricated building component with built-in chip
一种内置芯片节能智能散热的装配式建筑构件
WANG YINGHAO (Autor:in) / YOU JIEYONG (Autor:in) / WAN DONGBO (Autor:in) / WANG CHUNGUANG (Autor:in) / JIA GUOHUA (Autor:in) / LI SHUAI (Autor:in) / CHEN XING (Autor:in) / SHI HAONAN (Autor:in) / KANG YUYAO (Autor:in) / YANG YINGBIN (Autor:in)
21.09.2021
Patent
Elektronische Ressource
Chinesisch
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