Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Low-temperature ceramic layer for packaging LED (light-emitting diode) chip by taking inorganic glue as binder
The invention discloses a low-temperature ceramic layer for packaging an LED (Light Emitting Diode) chip by taking inorganic glue as a binder. The preparation method comprising the following steps: 10, uniformly dispersing aluminum oxide, aluminum dihydrogen phosphate and titanium oxide in deionized water, grinding, adding carboxymethyl cellulose, and continuing to grind to uniformly mix slurry, so as to obtain ceramic slurry; and 20, uniformly coating the surface of a chip substrate with the ceramic slurry to cover the position of a chip to form a flat film surface, calcining the chip coated with the ceramic slurry in a sintering furnace, and conducting natural cooling to form a ceramic layer on the surface of the chip. The low-temperature aluminum oxide ceramic layer has a lower dielectric constant, and also has better water-oxygen barrier property and ultraviolet aging resistance, so that the heat dissipation property of the LED chip is effectively improved, and the LED chip has excellent stability, durability and the like.
本发明公开了一种以无机胶为粘结剂的LED芯片封装用低温陶瓷层；包括：步骤10：将氧化铝、磷酸二氢铝、氧化钛均匀分散于去离子水中，研磨，加入羧甲基纤维素继续研磨使浆料混合均匀，得到陶瓷浆料；步骤20：将陶瓷浆料均匀涂于芯片基底表面覆盖芯片位置，形成平整膜面；将涂有陶瓷浆料的芯片置于烧结炉中进行煅烧，自然降温，芯片表面形成陶瓷层。该低温氧化铝陶瓷层具有较低的介电常数，同时具有较好的水氧阻隔性能与耐紫外老化性能，有效提高了LED芯片的散热性，使其具有优良的稳定性、耐用性等性能。
Low-temperature ceramic layer for packaging LED (light-emitting diode) chip by taking inorganic glue as binder
The invention discloses a low-temperature ceramic layer for packaging an LED (Light Emitting Diode) chip by taking inorganic glue as a binder. The preparation method comprising the following steps: 10, uniformly dispersing aluminum oxide, aluminum dihydrogen phosphate and titanium oxide in deionized water, grinding, adding carboxymethyl cellulose, and continuing to grind to uniformly mix slurry, so as to obtain ceramic slurry; and 20, uniformly coating the surface of a chip substrate with the ceramic slurry to cover the position of a chip to form a flat film surface, calcining the chip coated with the ceramic slurry in a sintering furnace, and conducting natural cooling to form a ceramic layer on the surface of the chip. The low-temperature aluminum oxide ceramic layer has a lower dielectric constant, and also has better water-oxygen barrier property and ultraviolet aging resistance, so that the heat dissipation property of the LED chip is effectively improved, and the LED chip has excellent stability, durability and the like.
本发明公开了一种以无机胶为粘结剂的LED芯片封装用低温陶瓷层；包括：步骤10：将氧化铝、磷酸二氢铝、氧化钛均匀分散于去离子水中，研磨，加入羧甲基纤维素继续研磨使浆料混合均匀，得到陶瓷浆料；步骤20：将陶瓷浆料均匀涂于芯片基底表面覆盖芯片位置，形成平整膜面；将涂有陶瓷浆料的芯片置于烧结炉中进行煅烧，自然降温，芯片表面形成陶瓷层。该低温氧化铝陶瓷层具有较低的介电常数，同时具有较好的水氧阻隔性能与耐紫外老化性能，有效提高了LED芯片的散热性，使其具有优良的稳定性、耐用性等性能。
Low-temperature ceramic layer for packaging LED (light-emitting diode) chip by taking inorganic glue as binder
一种以无机胶为粘结剂的LED芯片封装用低温陶瓷层
CHAI CHUNFANG (Autor:in) / JIE YAO (Autor:in) / DAI PENG (Autor:in) / HAN BING (Autor:in) / CHEN WEI (Autor:in)
08.10.2021
Patent
Elektronische Ressource
Chinesisch
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