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High-temperature adhesive for silicon carbide ceramic and composite material thereof, and preparation method and bonding method of high-temperature adhesive
The invention discloses a high-temperature adhesive for silicon carbide ceramic and a composite material thereof and a preparation method and bonding method of the high-temperature adhesive, in order to solve the problem that an existing welding method of a ceramic matrix composite material is limited by conditions such as high pressure and high temperature in the implementation process, and to widen the application range of the welding method in large thin-walled complex ceramic matrix composite components. The high-temperature adhesive is formed by compounding a liquid precursor solvent, an active material containing boron powder and inert powder, wherein the liquid precursor solvent plays a role in medium and low temperature bonding, the active material containing boron powder is oxidized in an air environment to generate borosilicate glass to play a role in high-temperature bonding, the inert powder fills cracking pores and micro-cracks of the liquid precursor to achieve a load transmission effect, and the liquid precursor solvent, the active material and the inert powder are well mixed and cured to form bonding strength. The high-temperature adhesive is simple in ingredients and convenient to use, the bonding strength can reach 10 MPa or above after high-temperature heat treatment in the air environment, and the high-temperature adhesive is suitable for large-area bonding of ceramic matrix composite materials.
本发明公开了一种碳化硅陶瓷及其复合材料的高温胶及其制备与粘接方法,用于解决陶瓷基复合材料现有焊接方法实施过程中的高压力和高温度等条件对焊接方法限制的问题,拓宽焊接方法在大型薄壁复杂陶瓷基复合材料构件的应用。高温胶由液态先驱体溶剂、含硼粉体的活性料和惰性粉体三者配合而成,液态先驱体溶剂发挥中低温粘接作用,含硼粉体的活性料在空气环境下氧化生成硅硼玻璃起到高温粘接作用,惰性粉体填充液态先驱体裂解孔隙和微裂纹起到的传递载荷作用,三者混合均匀经固化后形成粘接强度。本发明高温胶配料简单,使用方便,空气环境高温热处理后粘接强度可达10MPa以上,适合于陶瓷基复合材料大面积粘接应用。
High-temperature adhesive for silicon carbide ceramic and composite material thereof, and preparation method and bonding method of high-temperature adhesive
The invention discloses a high-temperature adhesive for silicon carbide ceramic and a composite material thereof and a preparation method and bonding method of the high-temperature adhesive, in order to solve the problem that an existing welding method of a ceramic matrix composite material is limited by conditions such as high pressure and high temperature in the implementation process, and to widen the application range of the welding method in large thin-walled complex ceramic matrix composite components. The high-temperature adhesive is formed by compounding a liquid precursor solvent, an active material containing boron powder and inert powder, wherein the liquid precursor solvent plays a role in medium and low temperature bonding, the active material containing boron powder is oxidized in an air environment to generate borosilicate glass to play a role in high-temperature bonding, the inert powder fills cracking pores and micro-cracks of the liquid precursor to achieve a load transmission effect, and the liquid precursor solvent, the active material and the inert powder are well mixed and cured to form bonding strength. The high-temperature adhesive is simple in ingredients and convenient to use, the bonding strength can reach 10 MPa or above after high-temperature heat treatment in the air environment, and the high-temperature adhesive is suitable for large-area bonding of ceramic matrix composite materials.
本发明公开了一种碳化硅陶瓷及其复合材料的高温胶及其制备与粘接方法,用于解决陶瓷基复合材料现有焊接方法实施过程中的高压力和高温度等条件对焊接方法限制的问题,拓宽焊接方法在大型薄壁复杂陶瓷基复合材料构件的应用。高温胶由液态先驱体溶剂、含硼粉体的活性料和惰性粉体三者配合而成,液态先驱体溶剂发挥中低温粘接作用,含硼粉体的活性料在空气环境下氧化生成硅硼玻璃起到高温粘接作用,惰性粉体填充液态先驱体裂解孔隙和微裂纹起到的传递载荷作用,三者混合均匀经固化后形成粘接强度。本发明高温胶配料简单,使用方便,空气环境高温热处理后粘接强度可达10MPa以上,适合于陶瓷基复合材料大面积粘接应用。
High-temperature adhesive for silicon carbide ceramic and composite material thereof, and preparation method and bonding method of high-temperature adhesive
碳化硅陶瓷及其复合材料的高温胶及其制备与粘接方法
ZHANG YI (Autor:in) / CUI XUEFENG (Autor:in) / LI XIAOPING (Autor:in) / CHENG LAIFEI (Autor:in) / FU ZHIQIANG (Autor:in) / CHEN XU (Autor:in) / WEI CHONG (Autor:in)
16.11.2021
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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