Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Binder for injection moulding composition
The invention relates to a binder for an injection-moulding composition, comprising: between 35 and 54% vol. of a polymer base; between 40 and 55% vol. of a mixture of wax; and approximately 10% vol. of a surfactant, wherein the polymer base contains copolymers of ethylene and methacrylic or acrylic acid, or copolymers of ethylene and vinyl acetate, or copolymers of ethylene comprising a maleic anhydride, or a mixture of said copolymers, in addition to polyethylene, polypropylene and an acrylic resin.
本发明涉及用于注塑组合物的粘合剂，其含有：35‑54体积％的聚合物基料；40‑55体积％的蜡混合物；和约10体积％的表面活性剂，其中聚合物基料含有乙烯和甲基丙烯酸或丙烯酸的共聚物，或乙烯和乙酸乙烯酯的共聚物，或含马来酸酐的乙烯共聚物，或这些共聚物的混合物，以及聚乙烯、聚丙烯和丙烯酸树脂。
Binder for injection moulding composition
The invention relates to a binder for an injection-moulding composition, comprising: between 35 and 54% vol. of a polymer base; between 40 and 55% vol. of a mixture of wax; and approximately 10% vol. of a surfactant, wherein the polymer base contains copolymers of ethylene and methacrylic or acrylic acid, or copolymers of ethylene and vinyl acetate, or copolymers of ethylene comprising a maleic anhydride, or a mixture of said copolymers, in addition to polyethylene, polypropylene and an acrylic resin.
本发明涉及用于注塑组合物的粘合剂，其含有：35‑54体积％的聚合物基料；40‑55体积％的蜡混合物；和约10体积％的表面活性剂，其中聚合物基料含有乙烯和甲基丙烯酸或丙烯酸的共聚物，或乙烯和乙酸乙烯酯的共聚物，或含马来酸酐的乙烯共聚物，或这些共聚物的混合物，以及聚乙烯、聚丙烯和丙烯酸树脂。
Binder for injection moulding composition
用于注塑组合物的粘合剂
CARTIER DAMIEN (Autor:in)
28.01.2022
Patent
Elektronische Ressource
Chinesisch