Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Semiconductor enhanced refrigeration device and connecting and fixing method thereof
The invention relates to a semiconductor enhanced refrigeration device. The device comprises an aluminum alloy fin, a semiconductor refrigeration sheet and two aluminum alloy supports connected together. The interior of the aluminum alloy support is an arc surface, the exterior of the aluminum alloy support is three planes, and each plane is provided with a boss and two threaded holes. The bosses are attached to the inner surface of the semiconductor refrigeration sheet, and the outer surface of the semiconductor refrigeration sheet is attached to the aluminum alloy fin. The center line of the aluminum alloy fin is provided with two counter bores, and the counter bores correspond to the threaded holes. Heat preservation cotton is arranged between the aluminum alloy fin and the aluminum alloy supports. The device is convenient to install and maintain, good in durability, high in heat transfer efficiency, simple and reliable in connecting and fixing method, high in practicability and suitable for special environment working conditions of permafrost regions.
本发明涉及一种半导体增强制冷装置，该装置包括铝合金翅片、半导体制冷片和两个连接在一起的铝合金支架。所述铝合金支架的内部为圆弧面，外部为三个平面，且每个平面上均设有一个凸台和两个螺纹孔；所述凸台与所述半导体制冷片的内表面贴合，该半导体制冷片的外表面与所述铝合金翅片贴合；所述铝合金翅片的中心线上设有两个沉头孔，该沉头孔与所述螺纹孔相对应；所述铝合金翅片与所述铝合金支架之间设有保温棉。本发明安装维护方便，耐用性好且传热效率高，连接固定方法简单可靠，实用性强，适用于多年冻土区的特殊环境工况。
Semiconductor enhanced refrigeration device and connecting and fixing method thereof
The invention relates to a semiconductor enhanced refrigeration device. The device comprises an aluminum alloy fin, a semiconductor refrigeration sheet and two aluminum alloy supports connected together. The interior of the aluminum alloy support is an arc surface, the exterior of the aluminum alloy support is three planes, and each plane is provided with a boss and two threaded holes. The bosses are attached to the inner surface of the semiconductor refrigeration sheet, and the outer surface of the semiconductor refrigeration sheet is attached to the aluminum alloy fin. The center line of the aluminum alloy fin is provided with two counter bores, and the counter bores correspond to the threaded holes. Heat preservation cotton is arranged between the aluminum alloy fin and the aluminum alloy supports. The device is convenient to install and maintain, good in durability, high in heat transfer efficiency, simple and reliable in connecting and fixing method, high in practicability and suitable for special environment working conditions of permafrost regions.
本发明涉及一种半导体增强制冷装置，该装置包括铝合金翅片、半导体制冷片和两个连接在一起的铝合金支架。所述铝合金支架的内部为圆弧面，外部为三个平面，且每个平面上均设有一个凸台和两个螺纹孔；所述凸台与所述半导体制冷片的内表面贴合，该半导体制冷片的外表面与所述铝合金翅片贴合；所述铝合金翅片的中心线上设有两个沉头孔，该沉头孔与所述螺纹孔相对应；所述铝合金翅片与所述铝合金支架之间设有保温棉。本发明安装维护方便，耐用性好且传热效率高，连接固定方法简单可靠，实用性强，适用于多年冻土区的特殊环境工况。
Semiconductor enhanced refrigeration device and connecting and fixing method thereof
一种半导体增强制冷装置及其连接固定方法
LIU YONGHENG (Autor:in) / CHEN JI (Autor:in) / SUN FANGZHEN (Autor:in) / WANG JUNCHENG (Autor:in) / MEI QIHANG (Autor:in) / GAO JIAWEI (Autor:in) / MA SHEN (Autor:in)
11.02.2022
Patent
Elektronische Ressource
Chinesisch
IPC:
E02D
FOUNDATIONS
,
Gründungen
/
F25B
Kältemaschinen, Kälteanlagen oder Kälteverfahren
,
REFRIGERATION MACHINES, PLANTS, OR SYSTEMS
/
F28D
Wärmetauscher, soweit in keiner anderen Unterklasse vorgesehen, in denen die Wärmetauschmittel nicht in direkte Berührung miteinander kommen
,
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
Fabricated building connecting structure and connecting and fixing method thereof
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