Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Adjustable wall surface mold with leveling structure
The invention relates to an adjustable wall surface mold with a leveling structure, which comprises a box-shaped wall surface mold main body with an opening on one side, and the wall surface mold main body consists of a first half box body and a second half box body arranged opposite to the first half box body; adjusting assemblies are arranged at the end, away from the first half box body connecting plate, of the first half box body main plate and the end, away from the second half box body connecting plate, of the second half box body main plate, and each adjusting assembly comprises a second half box body limiting plate which is arranged below the second half box body main plate and has a containing gap with the second half box body main plate. A containing gap is formed between the first half box body main plate and the second half box body main plate, the containing gap is matched with the thickness of the first half box body main plate, a first guide structure is arranged between the first half box body main plate and the second half box body main plate, the first half box body main plate can be arranged in a sliding mode along the containing gap, and a leveling structure is arranged between the first half box body main plate and the second half box body main plate and above the first guide structure. The leveling structure is a rubber sheet which is located on the same plane with the first half box body main plate and the second half box body main plate.
本发明涉及具有整平结构的可调式墙面模，包括呈一面开口的盒状墙面模主体，墙面模主体由第一半盒体及与第一半盒体相对设置的第二半盒体组成，第一半盒体主板远离第一半盒体连接板的一端及第二半盒体主板远离第二半盒体连接板的一端设有调节组件，调节组件包括设置于第二半盒体主板下方与第二半盒体主板之间具有容置间隙的第二半盒体限位板，容置间隙与第一半盒体主板厚度适配，第一半盒体主板与第二半盒体主板之间设置有第一导向结构，第一半盒体主板可沿容置间隙滑动设置，第一半盒体主板及第二半盒体主板之间在第一导向结构上方设有整平结构，整平结构为与第一半盒体主板及第二半盒体主板处于同一平面的橡胶片。
Adjustable wall surface mold with leveling structure
The invention relates to an adjustable wall surface mold with a leveling structure, which comprises a box-shaped wall surface mold main body with an opening on one side, and the wall surface mold main body consists of a first half box body and a second half box body arranged opposite to the first half box body; adjusting assemblies are arranged at the end, away from the first half box body connecting plate, of the first half box body main plate and the end, away from the second half box body connecting plate, of the second half box body main plate, and each adjusting assembly comprises a second half box body limiting plate which is arranged below the second half box body main plate and has a containing gap with the second half box body main plate. A containing gap is formed between the first half box body main plate and the second half box body main plate, the containing gap is matched with the thickness of the first half box body main plate, a first guide structure is arranged between the first half box body main plate and the second half box body main plate, the first half box body main plate can be arranged in a sliding mode along the containing gap, and a leveling structure is arranged between the first half box body main plate and the second half box body main plate and above the first guide structure. The leveling structure is a rubber sheet which is located on the same plane with the first half box body main plate and the second half box body main plate.
本发明涉及具有整平结构的可调式墙面模，包括呈一面开口的盒状墙面模主体，墙面模主体由第一半盒体及与第一半盒体相对设置的第二半盒体组成，第一半盒体主板远离第一半盒体连接板的一端及第二半盒体主板远离第二半盒体连接板的一端设有调节组件，调节组件包括设置于第二半盒体主板下方与第二半盒体主板之间具有容置间隙的第二半盒体限位板，容置间隙与第一半盒体主板厚度适配，第一半盒体主板与第二半盒体主板之间设置有第一导向结构，第一半盒体主板可沿容置间隙滑动设置，第一半盒体主板及第二半盒体主板之间在第一导向结构上方设有整平结构，整平结构为与第一半盒体主板及第二半盒体主板处于同一平面的橡胶片。
Adjustable wall surface mold with leveling structure
具有整平结构的可调式墙面模
LI ZHENXING (Autor:in) / NI XIAOYIN (Autor:in)
25.02.2022
Patent
Elektronische Ressource
Chinesisch
IPC:
E04G
SCAFFOLDING
,
Baugerüste
Adjustable wall leveling system and installation method thereof
| Europäisches Patentamt | 2023