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Ceramic composite material, manufacturing method thereof, shell of electronic equipment and electronic equipment
The invention discloses a ceramic composite material and a manufacturing method thereof, a shell of electronic equipment and the electronic equipment, and the ceramic composite material comprises a compact ceramic material layer; and a composite ceramic material layer which is arranged on the surface of the compact ceramic material layer; wherein the composite ceramic material layer comprises a porous ceramic material matrix with a plurality of pores, and a filling material which is filled in the plurality of pores, wherein the density of the filling material is smaller than that of the ceramic. The ceramic composite material provided by the invention not only retains the appearance touch feeling of a ceramic material, but also has the characteristic of light weight.
本申请公开了一种陶瓷复合材料及其制作方法、电子设备的壳体和电子设备,其中,所述陶瓷复合材料,包括:致密陶瓷材料层;以及复合陶瓷材料层,设置于所述致。致密陶瓷材料层的表面,其中,所述复合陶瓷材料层包括:多孔陶瓷材料基体,具有多个孔隙;和填充材料,填充于所述多个孔隙内,所述填充材料的密度小于陶瓷的密度。本申请提供的陶瓷复合材料既保留了陶瓷材料的外观触感,同时还具有质量轻的特点。
Ceramic composite material, manufacturing method thereof, shell of electronic equipment and electronic equipment
The invention discloses a ceramic composite material and a manufacturing method thereof, a shell of electronic equipment and the electronic equipment, and the ceramic composite material comprises a compact ceramic material layer; and a composite ceramic material layer which is arranged on the surface of the compact ceramic material layer; wherein the composite ceramic material layer comprises a porous ceramic material matrix with a plurality of pores, and a filling material which is filled in the plurality of pores, wherein the density of the filling material is smaller than that of the ceramic. The ceramic composite material provided by the invention not only retains the appearance touch feeling of a ceramic material, but also has the characteristic of light weight.
本申请公开了一种陶瓷复合材料及其制作方法、电子设备的壳体和电子设备,其中,所述陶瓷复合材料,包括:致密陶瓷材料层;以及复合陶瓷材料层,设置于所述致。致密陶瓷材料层的表面,其中,所述复合陶瓷材料层包括:多孔陶瓷材料基体,具有多个孔隙;和填充材料,填充于所述多个孔隙内,所述填充材料的密度小于陶瓷的密度。本申请提供的陶瓷复合材料既保留了陶瓷材料的外观触感,同时还具有质量轻的特点。
Ceramic composite material, manufacturing method thereof, shell of electronic equipment and electronic equipment
陶瓷复合材料及其制作方法、电子设备的壳体和电子设备
ZHANG WENYU (Autor:in)
25.02.2022
Patent
Elektronische Ressource
Chinesisch
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