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Assembly type floor heating floor module structure
The invention relates to an assembly type floor heating floor module structure which comprises an upper steel plate (1) and a lower steel plate (2), a plurality of upper grooves (101) which are staggered transversely and longitudinally are punched in the upper steel plate (1), a plurality of hemispherical lower protrusions (201) are punched on the lower steel plate (2) in an array mode, and flat lower flat welding spots (2011) are arranged at the tops of the lower protrusions (201). An upper flat welding spot (1011) corresponding to the lower flat welding spot (2011) is arranged on the upper groove (101), and the lower flat welding spot (2011) and the upper flat welding spot (1011) are connected in a welded mode. The device is simple in structure, convenient to manufacture and very beneficial to assembly and production.
本发明涉及一种装配式地暖地面模块结构,包括上钢板(1)和下钢板(2),所述上钢板(1)上冲压有多个横纵交错的上凹槽(101),所述下钢板(2)上阵列冲压有多个半球形的下凸起(201),所述下凸起(201)顶部设置有平整的下平焊点(2011),所述上凹槽(101)上设置有对应所述下平焊点(2011)的上平焊点(1011),所述下平焊点(2011)和上平焊点(1011)焊接连接。本装置结构简单,利于制造,非常有利于装配置生产。
Assembly type floor heating floor module structure
The invention relates to an assembly type floor heating floor module structure which comprises an upper steel plate (1) and a lower steel plate (2), a plurality of upper grooves (101) which are staggered transversely and longitudinally are punched in the upper steel plate (1), a plurality of hemispherical lower protrusions (201) are punched on the lower steel plate (2) in an array mode, and flat lower flat welding spots (2011) are arranged at the tops of the lower protrusions (201). An upper flat welding spot (1011) corresponding to the lower flat welding spot (2011) is arranged on the upper groove (101), and the lower flat welding spot (2011) and the upper flat welding spot (1011) are connected in a welded mode. The device is simple in structure, convenient to manufacture and very beneficial to assembly and production.
本发明涉及一种装配式地暖地面模块结构,包括上钢板(1)和下钢板(2),所述上钢板(1)上冲压有多个横纵交错的上凹槽(101),所述下钢板(2)上阵列冲压有多个半球形的下凸起(201),所述下凸起(201)顶部设置有平整的下平焊点(2011),所述上凹槽(101)上设置有对应所述下平焊点(2011)的上平焊点(1011),所述下平焊点(2011)和上平焊点(1011)焊接连接。本装置结构简单,利于制造,非常有利于装配置生产。
Assembly type floor heating floor module structure
一种装配式地暖地面模块结构
CHEN XIAOFEI (Autor:in)
01.03.2022
Patent
Elektronische Ressource
Chinesisch
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