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Ultra-precision grinding method with controllable ductile domain machining scale
The invention discloses an ultra-precision grinding method with controllable ductile domain processing scale, which is characterized in that the ductile domain processing scale is controllable by modifying workpieces such as silicon carbide, calcium fluoride and the like through plasmas, generating modified layers on the surfaces of the workpieces, greatly reducing the hardness and brittleness of the modified layers, and enabling plasma flow to uniformly act on the modified areas through a magnetic control homogenization effect; the modified area and thickness are controllable, then a porous diamond grinding wheel is adopted for ultra-precise grinding of the surface of a workpiece, the grinding depth is not larger than the sum of the thickness of a modified layer and the removal depth of a ductile domain of a material, and meanwhile grinding machining damage can be remarkably reduced through multi-blade micro-cutting of porous abrasive particles. Through efficient cooperation of the porous diamond grinding wheel and magnetic control homogenization plasma modification, low-damage machining with controllable ductile domain machining scale of silicon carbide and calcium fluoride workpieces can be achieved, modification and grinding can be conducted synchronously, the machining efficiency is high, and the industrial production requirement is met.
本发明公开了一种延性域加工尺度可控的超精密磨削方法，所述延性域加工尺度可控是通过等离子体改性碳化硅、氟化钙等工件，在其表面生成改性层，改性层硬度、脆性大幅降低，并通过磁控均化作用使等离子流均匀作用于改性区域，使改性面积、厚度可控，随后采用多孔质金刚石砂轮超精密磨削工件表面，磨削深度不大于改性层厚度加上材料本身延性域去除深度之和，同时多孔质磨粒的多刃微切削可显著减小磨削加工损伤。本发明通过多孔质金刚石砂轮高效协同磁控均化等离子体改性，不仅能够实现碳化硅、氟化钙工件延性域加工尺度可控的低损伤加工，而且改性与磨削可同步进行，加工效率高，满足工业化生产要求。
Ultra-precision grinding method with controllable ductile domain machining scale
The invention discloses an ultra-precision grinding method with controllable ductile domain processing scale, which is characterized in that the ductile domain processing scale is controllable by modifying workpieces such as silicon carbide, calcium fluoride and the like through plasmas, generating modified layers on the surfaces of the workpieces, greatly reducing the hardness and brittleness of the modified layers, and enabling plasma flow to uniformly act on the modified areas through a magnetic control homogenization effect; the modified area and thickness are controllable, then a porous diamond grinding wheel is adopted for ultra-precise grinding of the surface of a workpiece, the grinding depth is not larger than the sum of the thickness of a modified layer and the removal depth of a ductile domain of a material, and meanwhile grinding machining damage can be remarkably reduced through multi-blade micro-cutting of porous abrasive particles. Through efficient cooperation of the porous diamond grinding wheel and magnetic control homogenization plasma modification, low-damage machining with controllable ductile domain machining scale of silicon carbide and calcium fluoride workpieces can be achieved, modification and grinding can be conducted synchronously, the machining efficiency is high, and the industrial production requirement is met.
本发明公开了一种延性域加工尺度可控的超精密磨削方法，所述延性域加工尺度可控是通过等离子体改性碳化硅、氟化钙等工件，在其表面生成改性层，改性层硬度、脆性大幅降低，并通过磁控均化作用使等离子流均匀作用于改性区域，使改性面积、厚度可控，随后采用多孔质金刚石砂轮超精密磨削工件表面，磨削深度不大于改性层厚度加上材料本身延性域去除深度之和，同时多孔质磨粒的多刃微切削可显著减小磨削加工损伤。本发明通过多孔质金刚石砂轮高效协同磁控均化等离子体改性，不仅能够实现碳化硅、氟化钙工件延性域加工尺度可控的低损伤加工，而且改性与磨削可同步进行，加工效率高，满足工业化生产要求。
Ultra-precision grinding method with controllable ductile domain machining scale
一种延性域加工尺度可控的超精密磨削方法
LI WEI (Autor:in) / HU XIAOLONG (Autor:in) / REN YINGHUI (Autor:in) / JIANG CHAO (Autor:in) / DUAN HUIGAO (Autor:in) / HUANG XIANGMING (Autor:in)
07.06.2022
Patent
Elektronische Ressource
Chinesisch
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