Glue for lamination and lamination of ceramic green sheets and preparation method of ceramic packaging base: Fid-Bau Portal

Glue for lamination and lamination of ceramic green sheets and preparation method of ceramic packaging base

PAN YARUI / LIU YONGLIANG / ZHANG DONGYANG

The invention relates to glue for laminating ceramic green sheets and a preparation method of a ceramic packaging base, and belongs to the technical field of semiconductor manufacturing. The glue for laminating the ceramic green sheets is mainly prepared from a plasticizer, a solvent, an organic binder and ceramic powder, and the mass fraction of the ceramic powder in the glue is 1.5-13.5%. When the glue for lamination and lamination of the ceramic green sheets is used for lamination and lamination of the ceramic green sheets, the organic binder can play a temporary bonding role, in the subsequent high-temperature sintering process, organic components can be decomposed and discharged, and the ceramic powder can play a migration role and form a bonding layer in the sintering process. Besides, the content of the ceramic powder in the glue is relatively low, so that the thickness of a bonding layer formed in the sintering process is smaller under the condition that the thickness of the glue formed on the surface of the ceramic green sheet is certain, and relatively great adverse effects on the electroplating property and the conductivity of the sintered ceramic green sheet can be avoided.

本发明涉及一种陶瓷生片叠层压合用胶水、陶瓷封装基座的制备方法，属于半导体制造技术领域。本发明的陶瓷生片叠层压合用胶水主要由增塑剂、溶剂、有机粘结剂和陶瓷粉组成；所述陶瓷粉在胶水中的质量分数为1.5～13.5％。本发明的陶瓷生片叠层压合用胶水用于陶瓷生片叠层压合时，有机粘结剂可起到临时粘结作用，后续高温烧结过程中，有机组分会分解排出，陶瓷粉可起到承上启下的迁移作用并在烧结过程中形成粘合层。另外，由于胶水中陶瓷粉的含量较低，当在陶瓷生片表面形成的胶水的厚度一定的情况下，烧结过程中形成的粘合层的厚度更小，从而可以避免对烧结后的陶瓷生片的电镀性和导通性有较大的不良影响。

Zugriff

Download

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren