Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Surface metallization process of ceramic filter
The invention relates to a surface metallization process of a ceramic filter. The surface metallization process comprises the following steps: firstly, preparing slurry from copper powder and metal oxide powder; uniformly coating on the surface of the ceramic filter blank; and finally, drying and sintering at high temperature in a reducing atmosphere to form a copper metallization layer. Compared with a traditional silver component which is added with glass frits, the metallization layer is densified by adopting a Cu-O co-melting joint mode, the electric conductivity of the copper metallization layer is reduced to the minimum, meanwhile, enough bonding strength is given to a ceramic structure and the copper metallization layer, the price of copper is one tenth of that of silver, and the production cost is greatly reduced.
本发明涉及一种陶瓷滤波器的表面金属化工艺，包含以下步骤：先利用铜粉和金属氧化物粉制备浆料；再均匀涂布在陶瓷滤波器毛坯的表面；最后干燥后在还原气氛的高温下烧结，形成铜金属化层；本发明相比于传统银组分中添加玻璃熔块，通过采用Cu‑O共熔接合方式，使金属化层致密化，不仅将铜金属化层的导电度下降最小，同时赋予陶瓷结构物与铜金属化层足够的结合强度，且铜的价格是银价格的十分之一，大大降低了生产成本。
Surface metallization process of ceramic filter
The invention relates to a surface metallization process of a ceramic filter. The surface metallization process comprises the following steps: firstly, preparing slurry from copper powder and metal oxide powder; uniformly coating on the surface of the ceramic filter blank; and finally, drying and sintering at high temperature in a reducing atmosphere to form a copper metallization layer. Compared with a traditional silver component which is added with glass frits, the metallization layer is densified by adopting a Cu-O co-melting joint mode, the electric conductivity of the copper metallization layer is reduced to the minimum, meanwhile, enough bonding strength is given to a ceramic structure and the copper metallization layer, the price of copper is one tenth of that of silver, and the production cost is greatly reduced.
本发明涉及一种陶瓷滤波器的表面金属化工艺，包含以下步骤：先利用铜粉和金属氧化物粉制备浆料；再均匀涂布在陶瓷滤波器毛坯的表面；最后干燥后在还原气氛的高温下烧结，形成铜金属化层；本发明相比于传统银组分中添加玻璃熔块，通过采用Cu‑O共熔接合方式，使金属化层致密化，不仅将铜金属化层的导电度下降最小，同时赋予陶瓷结构物与铜金属化层足够的结合强度，且铜的价格是银价格的十分之一，大大降低了生产成本。
Surface metallization process of ceramic filter
一种陶瓷滤波器的表面金属化工艺
KANG NAM-GOO (Autor:in) / PARK CHAN-YOUNG (Autor:in)
30.08.2022
Patent
Elektronische Ressource
Chinesisch