Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Honeycomb structure and electrically heated carrier
The invention provides a honeycomb structure with low resistance and good thermal shock resistance and an electric heating type carrier. A honeycomb structure is a ceramic honeycomb structure having an outer peripheral wall and partition walls disposed on the inner side of the outer peripheral wall and defining a plurality of cells that form flow paths extending from one end surface to the other end surface, the honeycomb structure includes: (1) particles including at least one selected from silicon carbide, silicon nitride, and aluminum nitride; and (2) silicon doped with a dopant, the dopant being a group 13 element or a group 15 element, the silicon content (B) in the honeycomb structure being 20-80 mass%, and the porosity of the honeycomb structure being 30% or less.
本发明提供低电阻且耐热冲击性良好的蜂窝结构体及电加热式载体。一种蜂窝结构体，其是具有外周壁和隔壁的陶瓷制的蜂窝结构体，该隔壁配设于外周壁的内侧，并区划形成多个隔室，该多个隔室形成从一个端面延伸至另一个端面的流路，其中，蜂窝结构体含有：(1)包含从碳化硅、氮化硅及氮化铝中选择的一种以上的粒子；(2)利用掺杂物进行了掺杂的硅，掺杂物为13族元素或15族元素，蜂窝结构体中的硅含量(B)为20～80质量％，且蜂窝结构体的气孔率为30％以下。
Honeycomb structure and electrically heated carrier
The invention provides a honeycomb structure with low resistance and good thermal shock resistance and an electric heating type carrier. A honeycomb structure is a ceramic honeycomb structure having an outer peripheral wall and partition walls disposed on the inner side of the outer peripheral wall and defining a plurality of cells that form flow paths extending from one end surface to the other end surface, the honeycomb structure includes: (1) particles including at least one selected from silicon carbide, silicon nitride, and aluminum nitride; and (2) silicon doped with a dopant, the dopant being a group 13 element or a group 15 element, the silicon content (B) in the honeycomb structure being 20-80 mass%, and the porosity of the honeycomb structure being 30% or less.
本发明提供低电阻且耐热冲击性良好的蜂窝结构体及电加热式载体。一种蜂窝结构体，其是具有外周壁和隔壁的陶瓷制的蜂窝结构体，该隔壁配设于外周壁的内侧，并区划形成多个隔室，该多个隔室形成从一个端面延伸至另一个端面的流路，其中，蜂窝结构体含有：(1)包含从碳化硅、氮化硅及氮化铝中选择的一种以上的粒子；(2)利用掺杂物进行了掺杂的硅，掺杂物为13族元素或15族元素，蜂窝结构体中的硅含量(B)为20～80质量％，且蜂窝结构体的气孔率为30％以下。
Honeycomb structure and electrically heated carrier
蜂窝结构体及电加热式载体
INOUE TAKAYUKI (Autor:in) / HAMAZAKI MAKOTO (Autor:in) / YAMADA KOHEI (Autor:in)
20.09.2022
Patent
Elektronische Ressource
Chinesisch
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