Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Ceramic powder adhesive for electronic ceramics and preparation method thereof
The invention discloses a ceramic powder adhesive for electronic ceramics, which comprises the following components in percentage by mass: 45%-55% of resin, 45%-55% of solvent, 0.1%-0.5% of adhesion promoter, 0.2%-0.5% of defoaming agent, 0.5%-3% of filler and 0.5%-3% of thixotropic agent, and the sum of the percentages of the components is 100%. The resin is at least one of polyacrylate, hydroxyl acrylate, polyurethane acrylate, bisphenol A epoxy acrylate, polyvinyl alcohol and polyvinyl butyral. The added resin is good in compatibility with the alcohol solvent, the viscosity of a system can be greatly reduced, the ceramic powder can be uniformly dispersed in the resin without sedimentation, subsequent ceramic powder granulation is facilitated, the shrinkage of a cured product is small, the cured product can be decomposed or carbonized at a low temperature, few residues are left in a ceramic plate blank in a low-temperature sintering stage, and the curing process is simple. And the compact and high-strength ceramic plate can be finally obtained.
本发明公开了一种电子陶瓷用陶瓷粉胶黏剂，按质量百分比包括以下组分：树脂45％‑55％，溶剂45％‑55％、助粘接剂0.1％‑0.5％、消泡剂0.2％‑0.5％、填料0.5％‑3％，触变剂0.5％‑3％，上述各组分的百分比之和为100％，所述树脂为聚丙烯酸酯、羟基丙烯酸脂、聚氨酯丙烯酸脂、双酚A环氧丙烯酸酯、聚乙烯醇、聚乙烯醇缩丁醛中的至少一种。本发明加入的树脂与醇类溶剂相容性好，可大大降低体系粘度，陶瓷粉能在其中分散均匀，而不发生沉降，有利于后续的陶瓷粉造粒，固化产物收缩性小，且在低温下即可发生分解或碳化，在低温烧结阶段时，在陶瓷板胚料中残留很少，有利于最终获得致密和高强度陶瓷板。
Ceramic powder adhesive for electronic ceramics and preparation method thereof
The invention discloses a ceramic powder adhesive for electronic ceramics, which comprises the following components in percentage by mass: 45%-55% of resin, 45%-55% of solvent, 0.1%-0.5% of adhesion promoter, 0.2%-0.5% of defoaming agent, 0.5%-3% of filler and 0.5%-3% of thixotropic agent, and the sum of the percentages of the components is 100%. The resin is at least one of polyacrylate, hydroxyl acrylate, polyurethane acrylate, bisphenol A epoxy acrylate, polyvinyl alcohol and polyvinyl butyral. The added resin is good in compatibility with the alcohol solvent, the viscosity of a system can be greatly reduced, the ceramic powder can be uniformly dispersed in the resin without sedimentation, subsequent ceramic powder granulation is facilitated, the shrinkage of a cured product is small, the cured product can be decomposed or carbonized at a low temperature, few residues are left in a ceramic plate blank in a low-temperature sintering stage, and the curing process is simple. And the compact and high-strength ceramic plate can be finally obtained.
本发明公开了一种电子陶瓷用陶瓷粉胶黏剂，按质量百分比包括以下组分：树脂45％‑55％，溶剂45％‑55％、助粘接剂0.1％‑0.5％、消泡剂0.2％‑0.5％、填料0.5％‑3％，触变剂0.5％‑3％，上述各组分的百分比之和为100％，所述树脂为聚丙烯酸酯、羟基丙烯酸脂、聚氨酯丙烯酸脂、双酚A环氧丙烯酸酯、聚乙烯醇、聚乙烯醇缩丁醛中的至少一种。本发明加入的树脂与醇类溶剂相容性好，可大大降低体系粘度，陶瓷粉能在其中分散均匀，而不发生沉降，有利于后续的陶瓷粉造粒，固化产物收缩性小，且在低温下即可发生分解或碳化，在低温烧结阶段时，在陶瓷板胚料中残留很少，有利于最终获得致密和高强度陶瓷板。
Ceramic powder adhesive for electronic ceramics and preparation method thereof
一种电子陶瓷用陶瓷粉胶黏剂及其制备方法
SHIN OK-GU (Autor:in) / ZHENG JIANBAO (Autor:in) / LI JINQING (Autor:in) / LAI YUNAN (Autor:in) / MO HUA (Autor:in)
11.10.2022
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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