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Slurry treatment for deposition of rare earth hafnium tantalate-based barrier coatings
Methods of forming a sintered coating and the resulting coating on a substrate are provided. The sintered coating may include a rare earth compound having the following formula: A1-bBbZ1-dDdMO6, in which A is Al, Ga, In, Sc, Y, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Fe, Cr, Co, Mn, Bi, or a mixture thereof, and a sintering aid having a rare earth compound having the following formula: A1-bBbZ1-dDdMO6, in which A is a mixture of Al, Ga, In, Sc, Y, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Fe, Cr, Co, Mn, Bi, or a mixture thereof; b is 0 to about 0.5; z is Hf, Ti or a mixture thereof; d is Zr, Ce, Ge, Si or a mixture thereof; d is 0 to about 0.5; and M is Ta, Nb, or a mixture thereof. The coating may be densified at a sintering temperature (e.g., 1300 DEG C to 1600 DEG C).
提供了形成烧结涂层的方法以及基底上的所得涂层。烧结涂层可包含稀土化合物和烧结助剂,所述稀土化合物具有下式:A1‑bBbZ1‑dDdMO6,式中,A为Al、Ga、In、Sc、Y、Ce、Pr、Nd、Pm、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb、Lu、Fe、Cr、Co、Mn、Bi或它们的混合物;b为0至约0.5;Z为Hf、Ti或它们的混合物;D为Zr、Ce、Ge、Si或它们的混合物;d为0至约0.5;以及M为Ta、Nb或它们的混合物。涂层可在烧结温度(例如1300℃至1600℃)下致密化。
Slurry treatment for deposition of rare earth hafnium tantalate-based barrier coatings
Methods of forming a sintered coating and the resulting coating on a substrate are provided. The sintered coating may include a rare earth compound having the following formula: A1-bBbZ1-dDdMO6, in which A is Al, Ga, In, Sc, Y, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Fe, Cr, Co, Mn, Bi, or a mixture thereof, and a sintering aid having a rare earth compound having the following formula: A1-bBbZ1-dDdMO6, in which A is a mixture of Al, Ga, In, Sc, Y, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Fe, Cr, Co, Mn, Bi, or a mixture thereof; b is 0 to about 0.5; z is Hf, Ti or a mixture thereof; d is Zr, Ce, Ge, Si or a mixture thereof; d is 0 to about 0.5; and M is Ta, Nb, or a mixture thereof. The coating may be densified at a sintering temperature (e.g., 1300 DEG C to 1600 DEG C).
提供了形成烧结涂层的方法以及基底上的所得涂层。烧结涂层可包含稀土化合物和烧结助剂,所述稀土化合物具有下式:A1‑bBbZ1‑dDdMO6,式中,A为Al、Ga、In、Sc、Y、Ce、Pr、Nd、Pm、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb、Lu、Fe、Cr、Co、Mn、Bi或它们的混合物;b为0至约0.5;Z为Hf、Ti或它们的混合物;D为Zr、Ce、Ge、Si或它们的混合物;d为0至约0.5;以及M为Ta、Nb或它们的混合物。涂层可在烧结温度(例如1300℃至1600℃)下致密化。
Slurry treatment for deposition of rare earth hafnium tantalate-based barrier coatings
用于沉积稀土钽酸铪基屏障涂层的浆料处理
KIRBY GLEN HAROLD (Autor:in) / BARBER ERIC N (Autor:in)
29.11.2022
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
Slurry processing for deposition of rare earth hafnium tantalate based barrier coatings
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