Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Superimposed floor cover plate and construction method thereof
The invention discloses a laminated floor cover plate and a construction method thereof, belongs to the technical field of building structures, and aims to solve the problems that connection points between SP plates, between the SP plates and a laminated layer and between the SP plates and a precast beam are not firm enough and low in reliability due to the fact that the SP floor cover plate is constructed only through concrete pouring. A plurality of hollow holes which are transversely arranged are formed in the two end faces of each SP board, and the upper portions of the SP boards form a whole through pouring of a laminated layer. The key point is that every two adjacent SP boards are connected through a board side connecting piece, a plurality of vertical holes are formed in the upper surfaces close to the two ends of the SP boards, and the vertical holes are formed in the lower surfaces close to the two ends of the SP boards. The vertical holes are distributed right above the hollow holes in an array mode and communicate with the corresponding hollow holes, plate end connecting pieces are further installed between the hollow holes and the corresponding set of vertical holes, in the floor cover plate, connection between the end of the SP plate and the prefabricated beam and connection between the SP plate and the laminated layer are more stable and firmer, brittle failure is not prone to occurring in an earthquake, and the service life of the floor cover plate is prolonged. And the reliability of the laminated floor cover plate is enhanced.
本发明公开了一种叠合型楼盖板及其施工方法,属于建筑结构技术领域,以解决,SP楼盖板仅通过浇筑混凝土施工,导致SP板与SP板、SP板与叠合层、SP板与预制梁之间的各连接点不够牢固,可靠性不高的问题,包括多块并排的SP板,SP板的两个端面开设有多个横向排列的空心孔洞,SP板上方通过浇筑叠合层形成整体,其关键在于:相邻的两块SP板之间通过板侧连接件连接,靠近SP板两端的上表面开设有多个竖孔,竖孔按阵列式排布在空心孔洞的正上方且与对应的空心孔洞相通,在空心孔洞与对应的一组竖孔之间还安装有板端连接件,楼盖板中,SP板板端与预制梁和SP板与叠合层之间的连接更加稳定牢固,在地震下不易发生脆性破坏,增强了叠合型楼盖板的可靠性。
Superimposed floor cover plate and construction method thereof
The invention discloses a laminated floor cover plate and a construction method thereof, belongs to the technical field of building structures, and aims to solve the problems that connection points between SP plates, between the SP plates and a laminated layer and between the SP plates and a precast beam are not firm enough and low in reliability due to the fact that the SP floor cover plate is constructed only through concrete pouring. A plurality of hollow holes which are transversely arranged are formed in the two end faces of each SP board, and the upper portions of the SP boards form a whole through pouring of a laminated layer. The key point is that every two adjacent SP boards are connected through a board side connecting piece, a plurality of vertical holes are formed in the upper surfaces close to the two ends of the SP boards, and the vertical holes are formed in the lower surfaces close to the two ends of the SP boards. The vertical holes are distributed right above the hollow holes in an array mode and communicate with the corresponding hollow holes, plate end connecting pieces are further installed between the hollow holes and the corresponding set of vertical holes, in the floor cover plate, connection between the end of the SP plate and the prefabricated beam and connection between the SP plate and the laminated layer are more stable and firmer, brittle failure is not prone to occurring in an earthquake, and the service life of the floor cover plate is prolonged. And the reliability of the laminated floor cover plate is enhanced.
本发明公开了一种叠合型楼盖板及其施工方法,属于建筑结构技术领域,以解决,SP楼盖板仅通过浇筑混凝土施工,导致SP板与SP板、SP板与叠合层、SP板与预制梁之间的各连接点不够牢固,可靠性不高的问题,包括多块并排的SP板,SP板的两个端面开设有多个横向排列的空心孔洞,SP板上方通过浇筑叠合层形成整体,其关键在于:相邻的两块SP板之间通过板侧连接件连接,靠近SP板两端的上表面开设有多个竖孔,竖孔按阵列式排布在空心孔洞的正上方且与对应的空心孔洞相通,在空心孔洞与对应的一组竖孔之间还安装有板端连接件,楼盖板中,SP板板端与预制梁和SP板与叠合层之间的连接更加稳定牢固,在地震下不易发生脆性破坏,增强了叠合型楼盖板的可靠性。
Superimposed floor cover plate and construction method thereof
一种叠合型楼盖板及其施工方法
JIANG KAIXUAN (Autor:in) / LI JIANG (Autor:in) / LIU JIEPENG (Autor:in) / KANG SHAOBO (Autor:in) / SHAO PEILIU (Autor:in) / HU HUIFENG (Autor:in) / TANG WEIZHAO (Autor:in) / YANG XIUCHUAN (Autor:in)
27.06.2023
Patent
Elektronische Ressource
Chinesisch
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