Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Nanometer copper cylinder thermocompression bonding process
The invention discloses a nano-copper column thermocompression bonding process, which adopts a nano-copper column as a nano thermocompression bonding material, a layer of nano-copper column is plated on a silicon substrate through an oblique angle sputtering method, and then two pieces of ceramics and crystals plated with the nano-copper column are subjected to thermocompression bonding, so that the effective contact area is increased, the sintering temperature is low, and the yield is high. And high-quality bonding can be realized under the condition of 200 DEG C. According to the method, the to-be-bonded ceramic and crystal are buried in the plurality of silicon oxide spheres, and the preset pressure is indirectly applied through the graphite partition plate, so that the to-be-bonded surface can be prevented from being deformed due to non-uniform stress in the heat treatment process, the defects of non-bonded areas, bubbles and the like on the bonding surface of the laser crystal are prevented, and the bonding quality of the laser crystal is improved. And the optical quality and the mechanical strength of the bonding surface of the bonded laser crystal are improved.
本发明公开了一种纳米铜柱热压键合工艺，采用纳米铜柱作为纳米热压键合材料，通过斜角溅射法在硅基板上镀一层纳米铜柱，然后将两片镀有纳米铜柱的陶瓷和晶体进行热压键合，增加有效接触面积，且烧结温度低，可以在200℃条件下实现高质量键合。本方法将待键合的陶瓷、晶体埋没于多个氧化硅球体内，通过石墨隔板间接施加预设压力，可避免待键合表面在热处理过程中因受力不均匀而变形，防止激光晶体的键合面存有未键合区域、气泡等缺陷，提高键合的激光晶体的键合面光学质量和机械强度。
Nanometer copper cylinder thermocompression bonding process
The invention discloses a nano-copper column thermocompression bonding process, which adopts a nano-copper column as a nano thermocompression bonding material, a layer of nano-copper column is plated on a silicon substrate through an oblique angle sputtering method, and then two pieces of ceramics and crystals plated with the nano-copper column are subjected to thermocompression bonding, so that the effective contact area is increased, the sintering temperature is low, and the yield is high. And high-quality bonding can be realized under the condition of 200 DEG C. According to the method, the to-be-bonded ceramic and crystal are buried in the plurality of silicon oxide spheres, and the preset pressure is indirectly applied through the graphite partition plate, so that the to-be-bonded surface can be prevented from being deformed due to non-uniform stress in the heat treatment process, the defects of non-bonded areas, bubbles and the like on the bonding surface of the laser crystal are prevented, and the bonding quality of the laser crystal is improved. And the optical quality and the mechanical strength of the bonding surface of the bonded laser crystal are improved.
本发明公开了一种纳米铜柱热压键合工艺，采用纳米铜柱作为纳米热压键合材料，通过斜角溅射法在硅基板上镀一层纳米铜柱，然后将两片镀有纳米铜柱的陶瓷和晶体进行热压键合，增加有效接触面积，且烧结温度低，可以在200℃条件下实现高质量键合。本方法将待键合的陶瓷、晶体埋没于多个氧化硅球体内，通过石墨隔板间接施加预设压力，可避免待键合表面在热处理过程中因受力不均匀而变形，防止激光晶体的键合面存有未键合区域、气泡等缺陷，提高键合的激光晶体的键合面光学质量和机械强度。
Nanometer copper cylinder thermocompression bonding process
一种纳米铜柱热压键合工艺
FENG YINGJUN (Autor:in) / CHEN YUE (Autor:in)
18.08.2023
Patent
Elektronische Ressource
Chinesisch
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