Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Ceramic metal packaging shell, preparation method and application thereof
According to the technical scheme, the ceramic metal packaging shell comprises an aluminum oxide ceramic shell, the aluminum oxide ceramic shell is of a frame type structure, and protruding strips are formed on the inner wall of the aluminum oxide ceramic shell; the tungsten copper bottom plate is provided with a stepped platform structure, the upper half part of the tungsten copper bottom plate is a core area cavity, the lower half part of the tungsten copper bottom plate is a heat sink cavity, the tungsten copper bottom plate is welded on the aluminum oxide ceramic shell, and the core area cavity corresponds to the raised line part on the inner side of the aluminum oxide ceramic shell; and the kovar alloy cover plate is welded on the aluminum oxide ceramic shell. The invention has the advantages that the ceramic has good air tightness, and can resist the influence of extreme environments such as high temperature, high humidity, corrosion radiation and the like on electronic devices after being packaged; the ceramic has a thermal expansion coefficient matched with that of metal, is good in mechanical property, and is hardly damaged after a thermal shock test and a temperature cycle test.
本发明是通过如下的技术方案来实现：一种陶瓷金属封装外壳，包括氧化铝陶瓷外壳，所述氧化铝陶瓷外壳设置框体式结构，所述氧化铝陶瓷外壳内壁上形成有凸条；钨铜底板，所述钨铜底板设置阶梯台结构，所述钨铜底板上半部分为芯区腔体，下半部分为热沉腔体，所述钨铜底板焊接在氧化铝陶瓷外壳，所述芯区腔体对应氧化铝陶瓷外壳内侧凸条部位；可伐合金盖板，所述可伐合金盖板焊接在氧化铝陶瓷外壳上。本发明优点在于，陶瓷拥有良好的气密性，封装后可抵御高温、高湿、腐蚀辐射等极端环境对电子器件的影响；陶瓷拥有和金属匹配的热膨胀系数，机械性能良好，热冲击试验和温度循环试验后几乎不产生损伤。
Ceramic metal packaging shell, preparation method and application thereof
According to the technical scheme, the ceramic metal packaging shell comprises an aluminum oxide ceramic shell, the aluminum oxide ceramic shell is of a frame type structure, and protruding strips are formed on the inner wall of the aluminum oxide ceramic shell; the tungsten copper bottom plate is provided with a stepped platform structure, the upper half part of the tungsten copper bottom plate is a core area cavity, the lower half part of the tungsten copper bottom plate is a heat sink cavity, the tungsten copper bottom plate is welded on the aluminum oxide ceramic shell, and the core area cavity corresponds to the raised line part on the inner side of the aluminum oxide ceramic shell; and the kovar alloy cover plate is welded on the aluminum oxide ceramic shell. The invention has the advantages that the ceramic has good air tightness, and can resist the influence of extreme environments such as high temperature, high humidity, corrosion radiation and the like on electronic devices after being packaged; the ceramic has a thermal expansion coefficient matched with that of metal, is good in mechanical property, and is hardly damaged after a thermal shock test and a temperature cycle test.
本发明是通过如下的技术方案来实现：一种陶瓷金属封装外壳，包括氧化铝陶瓷外壳，所述氧化铝陶瓷外壳设置框体式结构，所述氧化铝陶瓷外壳内壁上形成有凸条；钨铜底板，所述钨铜底板设置阶梯台结构，所述钨铜底板上半部分为芯区腔体，下半部分为热沉腔体，所述钨铜底板焊接在氧化铝陶瓷外壳，所述芯区腔体对应氧化铝陶瓷外壳内侧凸条部位；可伐合金盖板，所述可伐合金盖板焊接在氧化铝陶瓷外壳上。本发明优点在于，陶瓷拥有良好的气密性，封装后可抵御高温、高湿、腐蚀辐射等极端环境对电子器件的影响；陶瓷拥有和金属匹配的热膨胀系数，机械性能良好，热冲击试验和温度循环试验后几乎不产生损伤。
Ceramic metal packaging shell, preparation method and application thereof
一种陶瓷金属封装外壳、制备方法及其应用
LIU AMIN (Autor:in) / YAN YONGFEI (Autor:in) / WANG ZIHAO (Autor:in)
10.11.2023
Patent
Elektronische Ressource
Chinesisch
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