Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thinning production method of beryllium oxide ceramic substrate
The invention relates to the field of beryllium oxide ceramics, in particular to a thinning production method of a beryllium oxide ceramic substrate, which can reduce the grinding amount of a sintered product by obtaining a thinner and smoother green body so as to improve the utilization rate of a beryllium oxide raw material, and comprises the following steps: a, preparing a beryllium oxide granulation material; b, preparing a beryllium oxide ceramic substrate; c, the green body is subjected to glue discharging and sintering, a ceramic body is obtained, the glue discharging temperature ranges from 350 DEG C to 1200 DEG C, and the sintering temperature ranges from 500 DEG C to 1750 DEG C; and d, machining, cleaning and drying the ceramic blank to obtain the beryllium oxide ceramic substrate. The method is particularly suitable for the production and manufacturing process of the beryllium oxide ceramic substrate.
本发明涉及氧化铍陶瓷领域，尤其是一种通过获得更薄更平整的生坯，从而使得烧成后产品磨量减少，并以此实现氧化铍原材料利用率的提升的氧化铍陶瓷基片的减薄生产方法，包括如下步骤：a、制备氧化铍造粒料；b、制备氧化铍陶瓷基片；c、生坯排胶和烧结后，得到陶瓷坯，排胶的温度范围为350℃‑1200℃，烧结的温度范围为500℃‑1750℃；d、陶瓷坯经机加工、清洗和干燥后得到氧化铍陶瓷基片。本发明尤其适用于氧化铍陶瓷基片的生产制作工艺之中。
Thinning production method of beryllium oxide ceramic substrate
The invention relates to the field of beryllium oxide ceramics, in particular to a thinning production method of a beryllium oxide ceramic substrate, which can reduce the grinding amount of a sintered product by obtaining a thinner and smoother green body so as to improve the utilization rate of a beryllium oxide raw material, and comprises the following steps: a, preparing a beryllium oxide granulation material; b, preparing a beryllium oxide ceramic substrate; c, the green body is subjected to glue discharging and sintering, a ceramic body is obtained, the glue discharging temperature ranges from 350 DEG C to 1200 DEG C, and the sintering temperature ranges from 500 DEG C to 1750 DEG C; and d, machining, cleaning and drying the ceramic blank to obtain the beryllium oxide ceramic substrate. The method is particularly suitable for the production and manufacturing process of the beryllium oxide ceramic substrate.
本发明涉及氧化铍陶瓷领域，尤其是一种通过获得更薄更平整的生坯，从而使得烧成后产品磨量减少，并以此实现氧化铍原材料利用率的提升的氧化铍陶瓷基片的减薄生产方法，包括如下步骤：a、制备氧化铍造粒料；b、制备氧化铍陶瓷基片；c、生坯排胶和烧结后，得到陶瓷坯，排胶的温度范围为350℃‑1200℃，烧结的温度范围为500℃‑1750℃；d、陶瓷坯经机加工、清洗和干燥后得到氧化铍陶瓷基片。本发明尤其适用于氧化铍陶瓷基片的生产制作工艺之中。
Thinning production method of beryllium oxide ceramic substrate
氧化铍陶瓷基片的减薄生产方法
LI HUAN (Autor:in) / SHANG HUA (Autor:in) / CAO KUN (Autor:in) / YANG CHENGHE (Autor:in)
17.11.2023
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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