Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The invention discloses a floor board and a reinforced splice board, and belongs to the technical field of composite boards. The base material layer comprises fiber resin powder with the length of 0.2-1.5 mm, the fiber resin powder is bonded and hardened through an adhesive to form a plate-shaped structure, copper particles are mixed in the fiber resin powder, and the granularity of the copper particles is 0.6-1.6 mm. Wherein the fiber resin powder is mutually connected in a staggered manner, so that the strength of the plate is improved; the contained copper particles can reduce pores in the base material, the density of the base material layer is improved, the strength of the board is further enhanced, and the problem that the floor is not suitable for a humid environment is solved.
本发明公开了一种地板板材及强化拼接板，属于复合板材技术领域。本发明的基材层包含长度为0.2～1.5mm的纤维树脂粉料，通过胶黏剂粘合，硬化后形成为板状结构，纤维树脂粉料中混有铜颗粒，铜颗粒的颗粒度为0.6～1.6mm。其中，纤维树脂粉料之间形成相互交错连接，从而提升板材的强度；含的铜颗粒能够减少基材中的孔隙，提升基材层的密度，进一步增强了板材强度，缓解了地板不适宜潮湿环境的问题。
The invention discloses a floor board and a reinforced splice board, and belongs to the technical field of composite boards. The base material layer comprises fiber resin powder with the length of 0.2-1.5 mm, the fiber resin powder is bonded and hardened through an adhesive to form a plate-shaped structure, copper particles are mixed in the fiber resin powder, and the granularity of the copper particles is 0.6-1.6 mm. Wherein the fiber resin powder is mutually connected in a staggered manner, so that the strength of the plate is improved; the contained copper particles can reduce pores in the base material, the density of the base material layer is improved, the strength of the board is further enhanced, and the problem that the floor is not suitable for a humid environment is solved.
本发明公开了一种地板板材及强化拼接板，属于复合板材技术领域。本发明的基材层包含长度为0.2～1.5mm的纤维树脂粉料，通过胶黏剂粘合，硬化后形成为板状结构，纤维树脂粉料中混有铜颗粒，铜颗粒的颗粒度为0.6～1.6mm。其中，纤维树脂粉料之间形成相互交错连接，从而提升板材的强度；含的铜颗粒能够减少基材中的孔隙，提升基材层的密度，进一步增强了板材强度，缓解了地板不适宜潮湿环境的问题。
Floor board and reinforced splice plate
一种地板板材及强化拼接板
LEI XIANG (Autor:in)
29.12.2023
Patent
Elektronische Ressource
Chinesisch
IPC:
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
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