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一种MLCC及改善生倒粘片的MLCC制造方法
本申请提出了一种MLCC及改善生倒粘片的MLCC制造方法。所述方法包括:将水和待排胶的陶瓷生坯按照预设比例混合;对混合的陶瓷生坯和水进行球磨处理,以使陶瓷生坯的棱角打磨成为圆角;对球磨处理后的陶瓷生坯进行滤水处理,并加入粉料混合搅拌均匀,以使陶瓷生坯的表面覆盖有粉料;对覆盖有粉料的陶瓷生坯进行排胶、烧结及倒角等处理,倒角处理可以去除沾附在陶瓷生坯表面的粉料。本申请可以避免内应力在陶瓷生坯的棱角处集中,从而避免陶瓷生坯在烧结及倒角制程中出现瓷损甚至开裂;粉料阻挡了粘结剂将陶瓷生坯粘结在一起,可以改善粘片现象以及由此导致的瓷损问题。
The invention provides an MLCC and an MLCC manufacturing method for improving a raw back adhesive sheet. The method comprises the following steps: mixing water and a ceramic green body to be degummed according to a preset proportion; the mixed ceramic green body and water are subjected to ball milling treatment, so that edges and corners of the ceramic green body are ground into round corners; carrying out water filtering treatment on the ceramic green body subjected to ball milling treatment, adding powder, and uniformly mixing and stirring, so that the surface of the ceramic green body is covered with the powder; and the ceramic green body covered with the powder is subjected to glue discharging, sintering, chamfering and other treatment, and the powder attached to the surface of the ceramic green body can be removed through chamfering treatment. The internal stress can be prevented from being concentrated at the corner angle of the ceramic green body, so that the ceramic green body is prevented from being damaged or even cracked in the sintering and chamfering process; and the powder prevents the binder from bonding the ceramic green bodies together, so that the chip bonding phenomenon and the ceramic damage problem caused by the chip bonding phenomenon can be improved.
一种MLCC及改善生倒粘片的MLCC制造方法
本申请提出了一种MLCC及改善生倒粘片的MLCC制造方法。所述方法包括:将水和待排胶的陶瓷生坯按照预设比例混合;对混合的陶瓷生坯和水进行球磨处理,以使陶瓷生坯的棱角打磨成为圆角;对球磨处理后的陶瓷生坯进行滤水处理,并加入粉料混合搅拌均匀,以使陶瓷生坯的表面覆盖有粉料;对覆盖有粉料的陶瓷生坯进行排胶、烧结及倒角等处理,倒角处理可以去除沾附在陶瓷生坯表面的粉料。本申请可以避免内应力在陶瓷生坯的棱角处集中,从而避免陶瓷生坯在烧结及倒角制程中出现瓷损甚至开裂;粉料阻挡了粘结剂将陶瓷生坯粘结在一起,可以改善粘片现象以及由此导致的瓷损问题。
The invention provides an MLCC and an MLCC manufacturing method for improving a raw back adhesive sheet. The method comprises the following steps: mixing water and a ceramic green body to be degummed according to a preset proportion; the mixed ceramic green body and water are subjected to ball milling treatment, so that edges and corners of the ceramic green body are ground into round corners; carrying out water filtering treatment on the ceramic green body subjected to ball milling treatment, adding powder, and uniformly mixing and stirring, so that the surface of the ceramic green body is covered with the powder; and the ceramic green body covered with the powder is subjected to glue discharging, sintering, chamfering and other treatment, and the powder attached to the surface of the ceramic green body can be removed through chamfering treatment. The internal stress can be prevented from being concentrated at the corner angle of the ceramic green body, so that the ceramic green body is prevented from being damaged or even cracked in the sintering and chamfering process; and the powder prevents the binder from bonding the ceramic green bodies together, so that the chip bonding phenomenon and the ceramic damage problem caused by the chip bonding phenomenon can be improved.
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