Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Circuit board and intelligent door lock
The invention relates to the technical field of electronic circuits, and discloses a circuit board and an intelligent door lock. The chip is arranged on the substrate; a plurality of bonding pads are arranged on the bottom end surface of the chip; the bonding pad extends along a direction far away from the chip; the bonding pad is suitable for placing soldering paste, and when the chip is attached to the substrate, the soldering paste flows in the bonding pad in the direction away from the chip. According to the embodiment of the invention, the bonding pad extends along the direction far away from the chip, so that the soldering paste flows along the part, exceeding the chip, of the bonding pad when the chip is attached to the substrate if the soldering paste is redundant during welding, and the soldering paste cannot overflow from the bonding pad, so that the chip is prevented from being damaged. Therefore, the soldering paste cannot be connected to the two adjacent pins at the same time, so that the normal operation of the chip is ensured, and the risk of short circuit is avoided.
本发明涉及电子电路技术领域，公开了一种电路板及智能门锁，该电路板包括：基板；芯片，设置在所述基板上；所述芯片的底部端面上设置有多个焊盘；所述焊盘沿远离所述芯片的方向进行延伸；所述焊盘上适于放置焊锡膏，且将所述芯片贴合到所述基板上时，所述焊锡膏在所述焊盘内沿远离所述芯片的方向流动。本发明实施例通过将焊盘沿远离芯片的方向进行延伸，在焊接时，如果焊锡膏出现多余的情况，那么在芯片贴合到基板上时，焊锡膏就会沿焊盘上超出芯片的部位进行流动，这样的话，焊锡膏也就无法从焊盘上溢出，焊锡膏也就无法同时连接在相邻的两个管脚上，从而保证芯片能够正常运作，不会出现短路的风险。
Circuit board and intelligent door lock
The invention relates to the technical field of electronic circuits, and discloses a circuit board and an intelligent door lock. The chip is arranged on the substrate; a plurality of bonding pads are arranged on the bottom end surface of the chip; the bonding pad extends along a direction far away from the chip; the bonding pad is suitable for placing soldering paste, and when the chip is attached to the substrate, the soldering paste flows in the bonding pad in the direction away from the chip. According to the embodiment of the invention, the bonding pad extends along the direction far away from the chip, so that the soldering paste flows along the part, exceeding the chip, of the bonding pad when the chip is attached to the substrate if the soldering paste is redundant during welding, and the soldering paste cannot overflow from the bonding pad, so that the chip is prevented from being damaged. Therefore, the soldering paste cannot be connected to the two adjacent pins at the same time, so that the normal operation of the chip is ensured, and the risk of short circuit is avoided.
本发明涉及电子电路技术领域，公开了一种电路板及智能门锁，该电路板包括：基板；芯片，设置在所述基板上；所述芯片的底部端面上设置有多个焊盘；所述焊盘沿远离所述芯片的方向进行延伸；所述焊盘上适于放置焊锡膏，且将所述芯片贴合到所述基板上时，所述焊锡膏在所述焊盘内沿远离所述芯片的方向流动。本发明实施例通过将焊盘沿远离芯片的方向进行延伸，在焊接时，如果焊锡膏出现多余的情况，那么在芯片贴合到基板上时，焊锡膏就会沿焊盘上超出芯片的部位进行流动，这样的话，焊锡膏也就无法从焊盘上溢出，焊锡膏也就无法同时连接在相邻的两个管脚上，从而保证芯片能够正常运作，不会出现短路的风险。
Circuit board and intelligent door lock
电路板及智能门锁
QIN KAIBING (Autor:in) / SANG SHENGWEI (Autor:in) / ZHU ZHILING (Autor:in) / YE FEI (Autor:in) / DENG YEHAO (Autor:in) / CHEN CHEN (Autor:in)
02.02.2024
Patent
Elektronische Ressource
Chinesisch
| Europäisches Patentamt | 2020
Intelligent door lock and intelligent door lock system
| Europäisches Patentamt | 2024
| Europäisches Patentamt | 2020