Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Ceramic wafer with surface shape and manufacturing method thereof
The invention discloses a ceramic wafer with a surface shape and a manufacturing method thereof, the ceramic wafer has an upper surface and a lower surface, and at least one of the upper surface and the lower surface has an irregular surface shape. The thickness difference (TTV) value between the two surfaces is between 0.1 [mu] m and 100 [mu] m, and the thickness difference (TTV) value between the two surfaces is between 0.1 [mu] m and 100 [mu] m. According to the ceramic wafer with the surface shape, by controlling the thickness difference of the wafer, not only is film coating facilitated, but also flowing of fluid can be improved, the film coating bonding force can be improved in the subsequent manufacturing process, and surface defects are reduced.
本发明公开了一种具有表面形状的陶瓷晶圆片及其制造方法，该陶瓷晶圆片具有一上表面及一下表面，且该上表面及该下表面的至少一者具有不规则的表面形状。该两表面之间的厚度差(total thickness variation，TTV)值介于0.1～100μm。本发明的具有表面形状的陶瓷晶圆片，藉由控制晶圆片的厚度差异，除了有助于镀膜外，亦能增进流体的流动，在后续制程中能提升镀膜接合力，并降低表面缺陷。
Ceramic wafer with surface shape and manufacturing method thereof
The invention discloses a ceramic wafer with a surface shape and a manufacturing method thereof, the ceramic wafer has an upper surface and a lower surface, and at least one of the upper surface and the lower surface has an irregular surface shape. The thickness difference (TTV) value between the two surfaces is between 0.1 [mu] m and 100 [mu] m, and the thickness difference (TTV) value between the two surfaces is between 0.1 [mu] m and 100 [mu] m. According to the ceramic wafer with the surface shape, by controlling the thickness difference of the wafer, not only is film coating facilitated, but also flowing of fluid can be improved, the film coating bonding force can be improved in the subsequent manufacturing process, and surface defects are reduced.
本发明公开了一种具有表面形状的陶瓷晶圆片及其制造方法，该陶瓷晶圆片具有一上表面及一下表面，且该上表面及该下表面的至少一者具有不规则的表面形状。该两表面之间的厚度差(total thickness variation，TTV)值介于0.1～100μm。本发明的具有表面形状的陶瓷晶圆片，藉由控制晶圆片的厚度差异，除了有助于镀膜外，亦能增进流体的流动，在后续制程中能提升镀膜接合力，并降低表面缺陷。
Ceramic wafer with surface shape and manufacturing method thereof
具有表面形状的陶瓷晶圆片及其制造方法
ZENG YANKAI (Autor:in) / JIANG BAIXUAN (Autor:in) / JIANG RUIFENG (Autor:in)
01.03.2024
Patent
Elektronische Ressource
Chinesisch
CERAMIC WAFER WITH SURFACE SHAPE AND MANUFACTURING THEREOF
| Europäisches Patentamt | 2024
CERAMIC WAFER WITH SURFACE SHAPE AND MANUFACTURING THEREOF
| Europäisches Patentamt | 2024