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Covering layer high-stamping repeated splitting grouting device and method
The invention discloses a covering layer high-stamping repeated splitting grouting device and method. During grouting, drilling is conducted with a small caliber, a hole opening is sealed, a drilled hole is divided into multiple sections with the preset length, and grouting is conducted on each hole section from top to bottom; according to the scheme, graded injection quantity quantitative grouting control is adopted, N times of repeated grouting needs to be carried out on each grouting hole section, pulse-shaped grout inlet low impact pressure is intermittently used when the injection rate is high in each time of repeated grouting, ultrahigh pulse-shaped grout inlet impact pressure and normal grout return pressure are intermittently used when the injection rate is low, and the grouting speed is high. Each time of repeated grouting needs to reach a set injection amount value, and repeated grouting of splitting, permeation and compaction is carried out on a grouting section stratum and an upper groutable stratum along different paths for multiple times; the grouting uniformity is greatly improved, and the problems of controllability, groutability and uniformity of grouting treatment of various covering layers or manual accumulation bodies are effectively solved.
本发明公开了一种覆盖层高冲压重复劈裂灌浆装置及方法,灌浆时以小口径进行钻孔并将孔口封闭处理,将钻孔分为预设长度的多段并自上而下的对每一个孔段进行灌浆;本方案采用分级注入量定量的灌浆控制,每一灌浆孔段均需进行N次重复灌浆,每一次重复灌浆都在较高注入率时,间歇性使用脉冲状进浆低冲击压力,在较低注入率时,间歇性使用超高脉冲状进浆冲击压力和正常回浆压力,每一次重复灌浆都需要达到设定的注入量值,对灌段地层及上部可灌地层多次沿不同路径进行劈裂、渗透和挤密的重复灌注;大幅提高灌注的均匀性,有效解决各类覆盖层或人工堆积体灌浆处理的可控性、可灌性和均匀性的难题。
Covering layer high-stamping repeated splitting grouting device and method
The invention discloses a covering layer high-stamping repeated splitting grouting device and method. During grouting, drilling is conducted with a small caliber, a hole opening is sealed, a drilled hole is divided into multiple sections with the preset length, and grouting is conducted on each hole section from top to bottom; according to the scheme, graded injection quantity quantitative grouting control is adopted, N times of repeated grouting needs to be carried out on each grouting hole section, pulse-shaped grout inlet low impact pressure is intermittently used when the injection rate is high in each time of repeated grouting, ultrahigh pulse-shaped grout inlet impact pressure and normal grout return pressure are intermittently used when the injection rate is low, and the grouting speed is high. Each time of repeated grouting needs to reach a set injection amount value, and repeated grouting of splitting, permeation and compaction is carried out on a grouting section stratum and an upper groutable stratum along different paths for multiple times; the grouting uniformity is greatly improved, and the problems of controllability, groutability and uniformity of grouting treatment of various covering layers or manual accumulation bodies are effectively solved.
本发明公开了一种覆盖层高冲压重复劈裂灌浆装置及方法,灌浆时以小口径进行钻孔并将孔口封闭处理,将钻孔分为预设长度的多段并自上而下的对每一个孔段进行灌浆;本方案采用分级注入量定量的灌浆控制,每一灌浆孔段均需进行N次重复灌浆,每一次重复灌浆都在较高注入率时,间歇性使用脉冲状进浆低冲击压力,在较低注入率时,间歇性使用超高脉冲状进浆冲击压力和正常回浆压力,每一次重复灌浆都需要达到设定的注入量值,对灌段地层及上部可灌地层多次沿不同路径进行劈裂、渗透和挤密的重复灌注;大幅提高灌注的均匀性,有效解决各类覆盖层或人工堆积体灌浆处理的可控性、可灌性和均匀性的难题。
Covering layer high-stamping repeated splitting grouting device and method
一种覆盖层高冲压重复劈裂灌浆装置及方法
FU PING (Autor:in) / YANG XIAODONG (Autor:in) / XING ZHANQING (Autor:in) / ZHAO WEIQUAN (Autor:in) / HUANG LIWEI (Autor:in) / WANG WENZHAO (Autor:in) / PEI XIAOLONG (Autor:in)
10.05.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
E02D
FOUNDATIONS
,
Gründungen
Splitting grouting technology and grouting method thereof
Europäisches Patentamt | 2021
|Europäisches Patentamt | 2023
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