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Heating element, method for preparing heating element and heating device
The invention discloses a heating body, a method for preparing the heating body and a heating device. The heating body comprises a substrate; the bonding layer is located on at least part of the surface of one side of the substrate; the conductive layer is located on the surface of the side, away from the substrate, of the bonding layer, and the conductive layer comprises 40 wt%-70 wt% of titanium nitride, 28 wt%-60 wt% of zirconium oxide, 1 wt%-4 wt% of yttrium oxide and 0.01 wt%-3 wt% of nickel oxide. Therefore, the heating body has relatively high hardness, relatively excellent high temperature resistance and relatively good compactness.
本申请公开了发热体、制备发热体的方法和发热装置,发热体包括:基板;粘结层,所述粘结层位于所述基板一侧的至少部分表面;导电层,所述导电层位于所述粘结层远离所述基板的一侧表面,所述导电层包括:40wt%‑70wt%的氮化钛、28wt%‑60wt%的氧化锆、1wt%‑4wt%的氧化钇和0.01wt%‑3wt%的氧化镍。由此,发热体具有较高的硬度、较优的耐高温性能和较好的致密性。
Heating element, method for preparing heating element and heating device
The invention discloses a heating body, a method for preparing the heating body and a heating device. The heating body comprises a substrate; the bonding layer is located on at least part of the surface of one side of the substrate; the conductive layer is located on the surface of the side, away from the substrate, of the bonding layer, and the conductive layer comprises 40 wt%-70 wt% of titanium nitride, 28 wt%-60 wt% of zirconium oxide, 1 wt%-4 wt% of yttrium oxide and 0.01 wt%-3 wt% of nickel oxide. Therefore, the heating body has relatively high hardness, relatively excellent high temperature resistance and relatively good compactness.
本申请公开了发热体、制备发热体的方法和发热装置,发热体包括:基板;粘结层,所述粘结层位于所述基板一侧的至少部分表面;导电层,所述导电层位于所述粘结层远离所述基板的一侧表面,所述导电层包括:40wt%‑70wt%的氮化钛、28wt%‑60wt%的氧化锆、1wt%‑4wt%的氧化钇和0.01wt%‑3wt%的氧化镍。由此,发热体具有较高的硬度、较优的耐高温性能和较好的致密性。
Heating element, method for preparing heating element and heating device
发热体、制备发热体的方法及发热装置
LIN XINPING (Autor:in) / JIANG PINYI (Autor:in)
21.06.2024
Patent
Elektronische Ressource
Chinesisch
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