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Ultrathin dielectric material for multilayer chip ceramic capacitor and preparation method of ultrathin dielectric material
The invention relates to an ultrathin dielectric material for a multilayer chip ceramic capacitor and a preparation method thereof, the ultrathin dielectric material is composed of a base material, an auxiliary material, a modifier and a sintering aid, the base material is superfine Ba TiO3 powder, the auxiliary material comprises NaNbO3, SrNaNbO, MnCO3 and MgO, the modifier is selected from two or more of MnO2, MgO, Nb2O5, CaTiO3, La2O3 and SiO2, and the sintering aid is selected from one or more of SrNaNbO, MnCO3 and MgO. And the sintering aid is selected from three or more than three of Bi2O3, CuO, Li2CO3, ZnO and B2O3. The invention relates to the technical field of ultrathin dielectric materials. The dielectric material is prepared by taking the superfine BaTiO3 powder as a matrix, the surface roughness can be reduced by double electric layers of the superfine BaTiO3 powder particles, short circuit between internal electrodes can be effectively prevented, the sintering temperature can be reduced so as to improve the yield in the production process, and the thickness of the dielectric material is reduced by reducing the fineness of the matrix, so that the dielectric material can be applied to the field of microwave dielectric materials. And the development requirements of miniaturization and high capacity of the multi-layer chip ceramic capacitor can be met.
本发明涉及一种多层片式陶瓷电容器用超薄介质材料及其制备方法，所述超薄介质材料由基料、辅助材料、改性剂和烧结助剂组成，所述基料为超细Ba TiO3粉体，所述辅助材料包括NaNbO3、SrNaNbO、MnCO3和MgO，所述改性剂选自MnO2、MgO、Nb2O5、CaTiO3、La2O3和SiO2中的两种或两种以上，所述烧结助剂选自Bi2O3、CuO、Li2CO3、ZnO和B2O3中的三种或三种以上。本发明涉及超薄介质材料的技术领域。本发明以超细BaTiO3粉体为基质制备介质材料，超细BaTiO3粉体粒的双电层可以降低表面粗糙度，有效地防止内部电极之间的短路，同时可降低烧结温度，以提高生产过程的良品率，同时通过减小基质的微细度，进而降低了电介质材料的厚度，有利于实现多层片式陶瓷电容器小型化、大容量的发展需求。
Ultrathin dielectric material for multilayer chip ceramic capacitor and preparation method of ultrathin dielectric material
The invention relates to an ultrathin dielectric material for a multilayer chip ceramic capacitor and a preparation method thereof, the ultrathin dielectric material is composed of a base material, an auxiliary material, a modifier and a sintering aid, the base material is superfine Ba TiO3 powder, the auxiliary material comprises NaNbO3, SrNaNbO, MnCO3 and MgO, the modifier is selected from two or more of MnO2, MgO, Nb2O5, CaTiO3, La2O3 and SiO2, and the sintering aid is selected from one or more of SrNaNbO, MnCO3 and MgO. And the sintering aid is selected from three or more than three of Bi2O3, CuO, Li2CO3, ZnO and B2O3. The invention relates to the technical field of ultrathin dielectric materials. The dielectric material is prepared by taking the superfine BaTiO3 powder as a matrix, the surface roughness can be reduced by double electric layers of the superfine BaTiO3 powder particles, short circuit between internal electrodes can be effectively prevented, the sintering temperature can be reduced so as to improve the yield in the production process, and the thickness of the dielectric material is reduced by reducing the fineness of the matrix, so that the dielectric material can be applied to the field of microwave dielectric materials. And the development requirements of miniaturization and high capacity of the multi-layer chip ceramic capacitor can be met.
本发明涉及一种多层片式陶瓷电容器用超薄介质材料及其制备方法，所述超薄介质材料由基料、辅助材料、改性剂和烧结助剂组成，所述基料为超细Ba TiO3粉体，所述辅助材料包括NaNbO3、SrNaNbO、MnCO3和MgO，所述改性剂选自MnO2、MgO、Nb2O5、CaTiO3、La2O3和SiO2中的两种或两种以上，所述烧结助剂选自Bi2O3、CuO、Li2CO3、ZnO和B2O3中的三种或三种以上。本发明涉及超薄介质材料的技术领域。本发明以超细BaTiO3粉体为基质制备介质材料，超细BaTiO3粉体粒的双电层可以降低表面粗糙度，有效地防止内部电极之间的短路，同时可降低烧结温度，以提高生产过程的良品率，同时通过减小基质的微细度，进而降低了电介质材料的厚度，有利于实现多层片式陶瓷电容器小型化、大容量的发展需求。
Ultrathin dielectric material for multilayer chip ceramic capacitor and preparation method of ultrathin dielectric material
一种多层片式陶瓷电容器用超薄介质材料及其制备方法
XU HAIBO (Autor:in) / HE YUZHOU (Autor:in) / WANG WEILU (Autor:in)
03.09.2024
Patent
Elektronische Ressource
Chinesisch
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