Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
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Gradient thermal expansion coefficient low-temperature co-fired ceramic substrate and preparation method thereof
The invention discloses a gradient thermal expansion coefficient low temperature co-fired ceramic substrate and a preparation method thereof, the ceramic is composed of the following components by mass: 80%-95% of borosilicate glass, 5%-20% of alumina, and 0.05%-3% of other oxides, and the ceramic is prepared by ball milling, drying, grinding, calcining, granulation, tape casting, superposition molding, and sintering. The thermal expansion coefficient of the ceramic material is adjustable in a range of 2.6 ppm/DEG C to 16.7 ppm/DEG C. The multilayer gradient thermal expansion coefficient ceramic packaging structure formed by stacking and co-firing the ceramic materials can be co-fired with electrode materials such as silver, copper and gold. And the thermal stress mismatch problem between the ceramic substrate and the PCB and chip materials (Si, GaN and GaAs) is eliminated through the gradient thermal expansion effect.
本发明公开了一种梯度热膨胀系数低温共烧陶瓷基板及其制备方法，所述陶瓷由以下质量百分比成分组成：硼硅酸盐玻璃80%‑95%，氧化铝5%‑20%，其他氧化物为0.05%‑3%，经球磨、烘干、研磨、煅烧、造粒、流延、叠加成型、烧结而制得。本发明陶瓷材料的热膨胀系数从2.6 ppm/℃‑16.7ppm/℃的范围内可调，由这些陶瓷材料叠加共烧所形成的多层梯度热膨胀系数陶瓷封装结构可与银、铜和金等电极材料共烧，并通过其梯度热膨胀效应消除陶瓷基板与PCB板及芯片材料（Si、GaN和GaAs）之间的热应力失配问题。
Gradient thermal expansion coefficient low-temperature co-fired ceramic substrate and preparation method thereof
The invention discloses a gradient thermal expansion coefficient low temperature co-fired ceramic substrate and a preparation method thereof, the ceramic is composed of the following components by mass: 80%-95% of borosilicate glass, 5%-20% of alumina, and 0.05%-3% of other oxides, and the ceramic is prepared by ball milling, drying, grinding, calcining, granulation, tape casting, superposition molding, and sintering. The thermal expansion coefficient of the ceramic material is adjustable in a range of 2.6 ppm/DEG C to 16.7 ppm/DEG C. The multilayer gradient thermal expansion coefficient ceramic packaging structure formed by stacking and co-firing the ceramic materials can be co-fired with electrode materials such as silver, copper and gold. And the thermal stress mismatch problem between the ceramic substrate and the PCB and chip materials (Si, GaN and GaAs) is eliminated through the gradient thermal expansion effect.
本发明公开了一种梯度热膨胀系数低温共烧陶瓷基板及其制备方法，所述陶瓷由以下质量百分比成分组成：硼硅酸盐玻璃80%‑95%，氧化铝5%‑20%，其他氧化物为0.05%‑3%，经球磨、烘干、研磨、煅烧、造粒、流延、叠加成型、烧结而制得。本发明陶瓷材料的热膨胀系数从2.6 ppm/℃‑16.7ppm/℃的范围内可调，由这些陶瓷材料叠加共烧所形成的多层梯度热膨胀系数陶瓷封装结构可与银、铜和金等电极材料共烧，并通过其梯度热膨胀效应消除陶瓷基板与PCB板及芯片材料（Si、GaN和GaAs）之间的热应力失配问题。
Gradient thermal expansion coefficient low-temperature co-fired ceramic substrate and preparation method thereof
一种梯度热膨胀系数低温共烧陶瓷基板及其制备方法
WANG SHAOQI (Autor:in) / LU CHUN (Autor:in) / WANG FEILONG (Autor:in) / YU JIAQI (Autor:in)
27.09.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
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