Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Binder for ceramics and electronic ceramic component
The invention relates to the field of binders, in particular to a binder for ceramics and an electronic ceramic component. The binder for ceramics is used in the ceramic manufacturing process, the binder comprises thermoplastic resin, and the thermoplastic resin at least comprises polyvinyl acetal resin; the binder is prepared into a deionized water solution or dispersion solution with the mass fraction of 10%, and the conductivity of the binder is smaller than or equal to 100 [mu] S/cm at the temperature of 25 DEG C. According to the ceramic binder and the electronic ceramic component provided by the invention, the conductivity of the polyvinyl acetal resin in the deionized water is controlled, so that the polyvinyl acetal as the binder is low in ash content and low in metal component content in a preparation process of a ceramic capacitor.
本发明涉及粘结剂领域，特别涉及一种陶瓷用粘结剂以及电子陶瓷元器件。本发明的陶瓷用粘结剂，所述粘结剂用于陶瓷制造过程中，所述粘结剂包括热塑性树脂，所述热塑性树脂至少包括聚乙烯醇缩醛树脂；粘结剂被配制成质量分数为10%的去离子水溶液或分散溶液，在25°C下，其电导率≤100μS/cm。本发明提供的陶瓷用粘结剂以及电子陶瓷元器件，通过控制聚乙烯醇缩醛树脂在去离子水中的电导率，由此聚乙烯醇缩醛作为粘结剂在陶瓷电容器的制备工艺中灰分含量低、金属成分含量低。
Binder for ceramics and electronic ceramic component
The invention relates to the field of binders, in particular to a binder for ceramics and an electronic ceramic component. The binder for ceramics is used in the ceramic manufacturing process, the binder comprises thermoplastic resin, and the thermoplastic resin at least comprises polyvinyl acetal resin; the binder is prepared into a deionized water solution or dispersion solution with the mass fraction of 10%, and the conductivity of the binder is smaller than or equal to 100 [mu] S/cm at the temperature of 25 DEG C. According to the ceramic binder and the electronic ceramic component provided by the invention, the conductivity of the polyvinyl acetal resin in the deionized water is controlled, so that the polyvinyl acetal as the binder is low in ash content and low in metal component content in a preparation process of a ceramic capacitor.
本发明涉及粘结剂领域，特别涉及一种陶瓷用粘结剂以及电子陶瓷元器件。本发明的陶瓷用粘结剂，所述粘结剂用于陶瓷制造过程中，所述粘结剂包括热塑性树脂，所述热塑性树脂至少包括聚乙烯醇缩醛树脂；粘结剂被配制成质量分数为10%的去离子水溶液或分散溶液，在25°C下，其电导率≤100μS/cm。本发明提供的陶瓷用粘结剂以及电子陶瓷元器件，通过控制聚乙烯醇缩醛树脂在去离子水中的电导率，由此聚乙烯醇缩醛作为粘结剂在陶瓷电容器的制备工艺中灰分含量低、金属成分含量低。
Binder for ceramics and electronic ceramic component
一种陶瓷用粘结剂以及电子陶瓷元器件
LIANG JUNYA (Autor:in) / TANG GUIPING (Autor:in) / HU SHUANG (Autor:in) / XU BONAN (Autor:in)
29.11.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
/
C08F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
,
Makromolekulare Verbindungen, erhalten durch Reaktionen, an denen nur ungesättigte Kohlenstoff-Kohlenstoff-Bindungen beteiligt sind
/
C09J
ADHESIVES
,
Klebstoffe
/
H01G
Kondensatoren
,
CAPACITORS
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
DIELECTRIC CERAMICS, DIELECTRIC CERAMIC PRODUCTION METHOD AND CERAMIC ELECTRONIC COMPONENT
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