Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Ceramic copper-clad carrier plate with stripping test structure and manufacturing method of ceramic copper-clad carrier plate
The invention discloses a ceramic copper-clad carrier plate with a stripping test structure and a manufacturing method of the ceramic copper-clad carrier plate, relates to the technical field of ceramic copper-clad carrier plates, and solves the problems that the stripping strength of the same batch of products needs to be speculated and judged according to a sampling result, and the reliability is poor. The manufacturing method of the ceramic copper-clad carrier plate with the stripping test structure comprises the steps that a ceramic substrate and a copper plate body of a copper-clad carrier plate body are manufactured, the copper-clad carrier plate body is provided with a stripping test area, and the stripping test area comprises a first area and a second area which are adjacent to each other; the manufacturing method comprises the following steps: S1, scraping off the bonding layer located in the first area on the ceramic substrate or the copper plate main body; s2, an isolation layer is arranged at the position, where the bonding layer is scraped, in the first area; s3, sintering to obtain a copper-clad carrier plate main body; s4, an isolation ring groove which is located in the stripping test area and stretches across the first area and the second area is etched, and a stripping test piece which is located in the isolation ring groove and stretches across the first area and the second area is formed.
本发明公开了一种具有剥离测试结构的陶瓷覆铜载板及其制造方法，涉及陶瓷覆铜载板技术领域，解决目前同批产品的剥离强度需要根据抽样结果推测判断，可靠性不好的问题。本发明实施例的一种具有剥离测试结构的陶瓷覆铜载板的制造方法，包括制造覆铜载板主体的陶瓷基板和铜板主体，覆铜载板主体上设有剥离测试区，剥离测试区包括紧邻的第一区域和第二区域；制造方法包括步骤：S1、刮除陶瓷基板或铜板主体上位于第一区域内的粘合层；S2、在第一区域内刮除了粘合层的位置设置隔离层；S3、烧结获得覆铜载板主体；S4、蚀刻出位于剥离测试区内并横跨第一区域和第二区域的隔离环槽，形成位于隔离环槽内并横跨第一区域和第二区域设置的剥离测试片。
Ceramic copper-clad carrier plate with stripping test structure and manufacturing method of ceramic copper-clad carrier plate
The invention discloses a ceramic copper-clad carrier plate with a stripping test structure and a manufacturing method of the ceramic copper-clad carrier plate, relates to the technical field of ceramic copper-clad carrier plates, and solves the problems that the stripping strength of the same batch of products needs to be speculated and judged according to a sampling result, and the reliability is poor. The manufacturing method of the ceramic copper-clad carrier plate with the stripping test structure comprises the steps that a ceramic substrate and a copper plate body of a copper-clad carrier plate body are manufactured, the copper-clad carrier plate body is provided with a stripping test area, and the stripping test area comprises a first area and a second area which are adjacent to each other; the manufacturing method comprises the following steps: S1, scraping off the bonding layer located in the first area on the ceramic substrate or the copper plate main body; s2, an isolation layer is arranged at the position, where the bonding layer is scraped, in the first area; s3, sintering to obtain a copper-clad carrier plate main body; s4, an isolation ring groove which is located in the stripping test area and stretches across the first area and the second area is etched, and a stripping test piece which is located in the isolation ring groove and stretches across the first area and the second area is formed.
本发明公开了一种具有剥离测试结构的陶瓷覆铜载板及其制造方法，涉及陶瓷覆铜载板技术领域，解决目前同批产品的剥离强度需要根据抽样结果推测判断，可靠性不好的问题。本发明实施例的一种具有剥离测试结构的陶瓷覆铜载板的制造方法，包括制造覆铜载板主体的陶瓷基板和铜板主体，覆铜载板主体上设有剥离测试区，剥离测试区包括紧邻的第一区域和第二区域；制造方法包括步骤：S1、刮除陶瓷基板或铜板主体上位于第一区域内的粘合层；S2、在第一区域内刮除了粘合层的位置设置隔离层；S3、烧结获得覆铜载板主体；S4、蚀刻出位于剥离测试区内并横跨第一区域和第二区域的隔离环槽，形成位于隔离环槽内并横跨第一区域和第二区域设置的剥离测试片。
Ceramic copper-clad carrier plate with stripping test structure and manufacturing method of ceramic copper-clad carrier plate
一种具有剥离测试结构的陶瓷覆铜载板及其制造方法
03.12.2024
Patent
Elektronische Ressource
Chinesisch
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