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Production process of aluminum nitride aluminum-coated ceramic substrate
The invention relates to the technical field of ceramic substrate materials, in particular to an aluminum nitride aluminum-coated ceramic substrate production process which comprises the following steps: mixing aluminum nitride powder and a nano reinforcing agent, and ensuring uniform dispersion by using high-precision mixing equipment to form mixed slurry; the method comprises the following steps: intermittently punching slurry on casting equipment at intervals so as to increase the surface contact area of a film at the position of a large part; carrying out a hot isostatic pressing sintering process on the thin film, enabling the thin film with holes to be located at the uppermost part, and processing at high temperature and high pressure to form a substrate with grooves in the surface; and carrying out plasma treatment on the substrate with the groove on the surface, and then uniformly depositing an aluminum layer on the surface of the substrate through a vacuum sputtering technology so as to carry out aluminum coating treatment. According to the method, the film with holes in part of positions is produced through the tape casting equipment to prepare the substrate with the groove in the surface, and then the aluminum layer is filled into the groove of the substrate, so that the connecting effect of the substrate and the aluminum layer is improved, and the conductivity and performance of the ceramic substrate are further improved.
本发明涉及陶瓷基板材料技术领域,具体涉及一种氮化铝覆铝陶瓷基板生产工艺,该生产工艺包括混合氮化铝粉末与纳米增强剂,使用高精度混合设备确保均匀分散,以形成混合浆料;在流延设备上将浆料间歇的进行隔段打孔,以增大部分位置的薄膜表面接触面积;对薄膜采用热等静压烧结工艺,并使带孔的薄膜位于最上方,在高温高压下处理以形成表面带凹槽的基板;对表面带凹槽的基板进行等离子处理,然后通过真空溅射技术,均匀沉积铝层在基板表面,以进行覆铝处理。本发明通过流延设备生产出部分位置带孔的薄膜,以制备出表面带凹槽的基板,再使铝层填充入基板的凹槽中,提高了基板与铝层的连接效果,进一步提高陶瓷基板的导电性和性能。
Production process of aluminum nitride aluminum-coated ceramic substrate
The invention relates to the technical field of ceramic substrate materials, in particular to an aluminum nitride aluminum-coated ceramic substrate production process which comprises the following steps: mixing aluminum nitride powder and a nano reinforcing agent, and ensuring uniform dispersion by using high-precision mixing equipment to form mixed slurry; the method comprises the following steps: intermittently punching slurry on casting equipment at intervals so as to increase the surface contact area of a film at the position of a large part; carrying out a hot isostatic pressing sintering process on the thin film, enabling the thin film with holes to be located at the uppermost part, and processing at high temperature and high pressure to form a substrate with grooves in the surface; and carrying out plasma treatment on the substrate with the groove on the surface, and then uniformly depositing an aluminum layer on the surface of the substrate through a vacuum sputtering technology so as to carry out aluminum coating treatment. According to the method, the film with holes in part of positions is produced through the tape casting equipment to prepare the substrate with the groove in the surface, and then the aluminum layer is filled into the groove of the substrate, so that the connecting effect of the substrate and the aluminum layer is improved, and the conductivity and performance of the ceramic substrate are further improved.
本发明涉及陶瓷基板材料技术领域,具体涉及一种氮化铝覆铝陶瓷基板生产工艺,该生产工艺包括混合氮化铝粉末与纳米增强剂,使用高精度混合设备确保均匀分散,以形成混合浆料;在流延设备上将浆料间歇的进行隔段打孔,以增大部分位置的薄膜表面接触面积;对薄膜采用热等静压烧结工艺,并使带孔的薄膜位于最上方,在高温高压下处理以形成表面带凹槽的基板;对表面带凹槽的基板进行等离子处理,然后通过真空溅射技术,均匀沉积铝层在基板表面,以进行覆铝处理。本发明通过流延设备生产出部分位置带孔的薄膜,以制备出表面带凹槽的基板,再使铝层填充入基板的凹槽中,提高了基板与铝层的连接效果,进一步提高陶瓷基板的导电性和性能。
Production process of aluminum nitride aluminum-coated ceramic substrate
一种氮化铝覆铝陶瓷基板生产工艺
LIU WEIPING (Autor:in) / TAN CHENGYE (Autor:in) / ZHANG CAIGEN (Autor:in) / CHEN JINDUI (Autor:in)
06.12.2024
Patent
Elektronische Ressource
Chinesisch
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