Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Broadband near-infrared fluorescent ceramic as well as preparation method and application thereof
The invention provides broadband near-infrared fluorescent ceramic as well as a preparation method and application thereof, and relates to the technical field of luminescent materials. The chemical composition of the broadband near-infrared fluorescent ceramic is MgAlxSiyOz: mCr < 3 + >, and the preparation method comprises the following steps: fully mixing raw materials to obtain a uniform mixture, firstly pressing the uniform mixture into a green body, then pressing the green body into a blank, carrying out a solid-phase reaction under a vacuum condition, and cooling to obtain the broadband near-infrared fluorescent ceramic. Compared with the prior art, the broadband near-infrared fluorescent ceramic prepared by the invention has the advantages that the heat-conducting property (-10 W/m/K) of the broadband near-infrared fluorescent ceramic is far higher than that of organic resin (-0.2 W/m/K), so that the broadband near-infrared fluorescent ceramic can bear irradiation of high-power LED/LD exciting light; the light-emitting device prepared from the organic curing adhesive effectively solves the problem that the light-emitting performance is reduced due to the fact that the organic curing adhesive in a traditional powder packaging device is prone to aging in long-term high-temperature work of the LED chip.
本发明提供一种宽带近红外荧光陶瓷及其制备方法和应用，涉及发光材料技术领域。此宽带近红外荧光陶瓷的化学组成为MgAlxSiyOz:mCr3+，制备方法包括：将原料充分混合得到均匀混合物，将均匀混合物先压制成素胚，随后压制成毛坯并在真空条件下进行固相反应，经冷却后得到宽带近红外荧光陶瓷。与现有技术相比，本发明制得的宽带近红外荧光陶瓷由于其导热性能（~10 W/m/K）远高于有机树脂（~0.2 W/m/K），因此能够承受高功率LED/LD激发光的辐照，由其制备的发光装置有效解决了传统粉体封装装置中有机固化胶在LED芯片长期高温工作中易老化而引发发光性能下降的问题。
Broadband near-infrared fluorescent ceramic as well as preparation method and application thereof
The invention provides broadband near-infrared fluorescent ceramic as well as a preparation method and application thereof, and relates to the technical field of luminescent materials. The chemical composition of the broadband near-infrared fluorescent ceramic is MgAlxSiyOz: mCr < 3 + >, and the preparation method comprises the following steps: fully mixing raw materials to obtain a uniform mixture, firstly pressing the uniform mixture into a green body, then pressing the green body into a blank, carrying out a solid-phase reaction under a vacuum condition, and cooling to obtain the broadband near-infrared fluorescent ceramic. Compared with the prior art, the broadband near-infrared fluorescent ceramic prepared by the invention has the advantages that the heat-conducting property (-10 W/m/K) of the broadband near-infrared fluorescent ceramic is far higher than that of organic resin (-0.2 W/m/K), so that the broadband near-infrared fluorescent ceramic can bear irradiation of high-power LED/LD exciting light; the light-emitting device prepared from the organic curing adhesive effectively solves the problem that the light-emitting performance is reduced due to the fact that the organic curing adhesive in a traditional powder packaging device is prone to aging in long-term high-temperature work of the LED chip.
本发明提供一种宽带近红外荧光陶瓷及其制备方法和应用，涉及发光材料技术领域。此宽带近红外荧光陶瓷的化学组成为MgAlxSiyOz:mCr3+，制备方法包括：将原料充分混合得到均匀混合物，将均匀混合物先压制成素胚，随后压制成毛坯并在真空条件下进行固相反应，经冷却后得到宽带近红外荧光陶瓷。与现有技术相比，本发明制得的宽带近红外荧光陶瓷由于其导热性能（~10 W/m/K）远高于有机树脂（~0.2 W/m/K），因此能够承受高功率LED/LD激发光的辐照，由其制备的发光装置有效解决了传统粉体封装装置中有机固化胶在LED芯片长期高温工作中易老化而引发发光性能下降的问题。
Broadband near-infrared fluorescent ceramic as well as preparation method and application thereof
一种宽带近红外荧光陶瓷及其制备方法和应用
ZHOU YIRAN (Autor:in) / ZOU YINI (Autor:in) / ZHENG GUOJUN (Autor:in) / XIAO WENGE (Autor:in) / QIU JIANRONG (Autor:in)
20.12.2024
Patent
Elektronische Ressource
Chinesisch
IPC:
C04B
Kalk
,
LIME
/
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
H01S
Vorrichtungen, die stimulierte Emission verwenden
,
DEVICES USING STIMULATED EMISSION
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