Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Construction method for water seepage treatment of building basement bottom plate
The invention relates to the technical field of water seepage treatment, in particular to a construction method for water seepage treatment of a building basement bottom plate, which comprises the following steps: S1, organizing construction according to site construction conditions and procedure arrangement; s2, chiseling away an original decorative surface layer; s3, bottom plate concrete is chiseled away along the position of the existing grouting pipe, and the chiseling opening range is phi 300 * 30 mm; s4, low-pressure grouting is conducted through the existing grouting pipe; s5, water absorption treatment; s6, primary plugging treatment; s7, treating surrounding cracks; s8, redundant slurry pipes are cut off; s9, chiseling off opening sealing and secondary blocking are conducted; s10, pressing and smearing easy plaster; s11, construction of a laminated layer; and S12, building ground restoration. The device has the effect of treating the water seepage condition of the bottom plate.
本申请涉及渗水处理的技术领域，尤其是涉及一种建筑地下室底板渗水处理的施工方法，其包括如下步骤：S1：根据现场施工条件及工序安排，组织施工；S2：凿除原装饰面层；S3：沿既有注浆管位置凿除底板混凝土，凿除口范围为Φ300*30mm；S4：既有注浆管低压注浆；S5：吸水处理；S6：初次封堵处理；S7：周围裂缝处理；S8：多余浆管切除；S9：凿除口封口与二次封堵；S10：压抹益胶泥；S11：叠合层施工；S12：建筑地面恢复。本申请具有处理底板渗水的情况的效果。
Construction method for water seepage treatment of building basement bottom plate
The invention relates to the technical field of water seepage treatment, in particular to a construction method for water seepage treatment of a building basement bottom plate, which comprises the following steps: S1, organizing construction according to site construction conditions and procedure arrangement; s2, chiseling away an original decorative surface layer; s3, bottom plate concrete is chiseled away along the position of the existing grouting pipe, and the chiseling opening range is phi 300 * 30 mm; s4, low-pressure grouting is conducted through the existing grouting pipe; s5, water absorption treatment; s6, primary plugging treatment; s7, treating surrounding cracks; s8, redundant slurry pipes are cut off; s9, chiseling off opening sealing and secondary blocking are conducted; s10, pressing and smearing easy plaster; s11, construction of a laminated layer; and S12, building ground restoration. The device has the effect of treating the water seepage condition of the bottom plate.
本申请涉及渗水处理的技术领域，尤其是涉及一种建筑地下室底板渗水处理的施工方法，其包括如下步骤：S1：根据现场施工条件及工序安排，组织施工；S2：凿除原装饰面层；S3：沿既有注浆管位置凿除底板混凝土，凿除口范围为Φ300*30mm；S4：既有注浆管低压注浆；S5：吸水处理；S6：初次封堵处理；S7：周围裂缝处理；S8：多余浆管切除；S9：凿除口封口与二次封堵；S10：压抹益胶泥；S11：叠合层施工；S12：建筑地面恢复。本申请具有处理底板渗水的情况的效果。
Construction method for water seepage treatment of building basement bottom plate
一种建筑地下室底板渗水处理的施工方法
ZHAN TIANHUA (Autor:in) / LIN QIHUI (Autor:in) / PENG LISHUN (Autor:in) / ZHOU JINWEN (Autor:in) / LUO JIAHAO (Autor:in) / CHANG CHENGZHANG (Autor:in)
21.01.2025
Patent
Elektronische Ressource
Chinesisch
IPC:
E02D
FOUNDATIONS
,
Gründungen
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