Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
LEAD-FREE AND CADMIUM-FREE CONDUCTIVE THICK FILM PASTES
Thick film conductive copper pastes that are lead-free and cadmium-free. The inventive copper pastes possess desirable characteristics, including good solderability, good wire bondability, a low firing temperature, and a wide temperature processing window, and provide excellent adhesion to a variety of substrates, including alumina and glass coated stainless steel substrates, as well as low resistivity, and a microstructure after firing that is dense and substantially free of pores.
LEAD-FREE AND CADMIUM-FREE CONDUCTIVE THICK FILM PASTES
Thick film conductive copper pastes that are lead-free and cadmium-free. The inventive copper pastes possess desirable characteristics, including good solderability, good wire bondability, a low firing temperature, and a wide temperature processing window, and provide excellent adhesion to a variety of substrates, including alumina and glass coated stainless steel substrates, as well as low resistivity, and a microstructure after firing that is dense and substantially free of pores.
LEAD-FREE AND CADMIUM-FREE CONDUCTIVE THICK FILM PASTES
BLEI- UND CADMIUMFREIE LEITFÄHIGE DICKSCHICHTPASTEN
PATES CONDUCTRICES EN COUCHES EPAISSES A BASE DE METAL EXEMPTES DE PLOMB ET DE CADMIUM
SRIDHARAN SRINIVASAN (Autor:in) / BROWN ORVILLE (Autor:in)
08.01.2020
Patent
Elektronische Ressource
Englisch
Preparation of ultra-fine copper powder and its lead-free conductive thick film
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Part II: Developing tin-lead and lead-free solder pastes
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