Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME
According to one embodiment, a ceramic circuit board includes a ceramic substrate (1), a copper circuit plate (5) and a brazing material protrudent part (4a). The copper circuit plate (5) is bonded to at least one surface of the ceramic substrate (1) through a brazing material layer including Ag, Cu, and Ti. The brazing material protrudent part (4a) is formed by the brazing material layer which protrudes outward from a side surface of the copper circuit plate. The brazing material protrudent part (4a) includes a Ti phase and a TiN phase by 3% by mass or more in total, which is different from the total amount of a Ti phase and a TiN phase in the brazing material layer (4b) that is interposed between the ceramic substrate and the copper circuit plate. The number of voids each having an area of 200 µm 2 or less in the brazing material protrudent part (4a) is one or less (including zero).
CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME
According to one embodiment, a ceramic circuit board includes a ceramic substrate (1), a copper circuit plate (5) and a brazing material protrudent part (4a). The copper circuit plate (5) is bonded to at least one surface of the ceramic substrate (1) through a brazing material layer including Ag, Cu, and Ti. The brazing material protrudent part (4a) is formed by the brazing material layer which protrudes outward from a side surface of the copper circuit plate. The brazing material protrudent part (4a) includes a Ti phase and a TiN phase by 3% by mass or more in total, which is different from the total amount of a Ti phase and a TiN phase in the brazing material layer (4b) that is interposed between the ceramic substrate and the copper circuit plate. The number of voids each having an area of 200 µm 2 or less in the brazing material protrudent part (4a) is one or less (including zero).
CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME
KERAMIKLEITERPLATTE UND HERSTELLUNGSVERFAHREN DAFÜR
CARTE DE CIRCUIT CÉRAMIQUE ET PROCÉDÉ DE FABRICATION ASSOCIÉ
KATO HIROMASA (Autor:in)
09.08.2017
Patent
Elektronische Ressource
Englisch