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COMPOSITION POLYAMIDE DE FAIBLE CONDUCTIVITE THERMIQUE
A polyamide composition that can be used in different transformation methods and, in particular, for the production of an extrusion profile having a low thermal conductivity, is described. One such composition includes, in particular, glass beads. Also described is a composition, preferably a molding composition, e.g., in the form of granules or powder, that can be used to produce items by means of injection molding.
COMPOSITION POLYAMIDE DE FAIBLE CONDUCTIVITE THERMIQUE
A polyamide composition that can be used in different transformation methods and, in particular, for the production of an extrusion profile having a low thermal conductivity, is described. One such composition includes, in particular, glass beads. Also described is a composition, preferably a molding composition, e.g., in the form of granules or powder, that can be used to produce items by means of injection molding.
COMPOSITION POLYAMIDE DE FAIBLE CONDUCTIVITE THERMIQUE
POLYAMIDE COMPOSITION WITH LOW THERMAL CONDUCTIVITY
POLYAMIDZUSAMMENSETZUNG MIT GERINGER WÄRMELEITFÄHIGKEIT
BRADLEY GERARD (Autor:in)
03.04.2019
Patent
Elektronische Ressource
Französisch
IPC:
C08L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
,
Massen auf Basis makromolekularer Verbindungen
/
E06B
Feste oder bewegliche Abschlüsse für Öffnungen in Bauwerken, Fahrzeugen, Zäunen oder ähnlichen Einfriedungen allgemein, z.B. Türen, Fenster, Läden, Tore
,
FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES, OR LIKE ENCLOSURES, IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
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