THICK-FILM PASTES CONTAINING LEAD-TELLURIUM-BORON-OXIDES, AND THEIR USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES: Fid-Bau Portal

THICK-FILM PASTES CONTAINING LEAD-TELLURIUM-BORON-OXIDES, AND THEIR USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES

CARROLL ALAN FREDERICK / HANG KENNETH WARREN / LAUGHLIN BRIAN J / MIKESKA KURT RICHARD / TORARDI CARMINE / VERNOOY PAUL DOUGLAS

Abstract

The present invention provides a thick-film paste for printing the front-side of a solar cell device having one or more insulating layers. The thick-film paste comprises an electrically conductive metal, and a lead-tellurium-oxide dispersed in an organic medium.

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THICK-FILM PASTES CONTAINING LEAD-TELLURIUM-BORON-OXIDES, AND THEIR USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES

CARROLL ALAN FREDERICK / HANG KENNETH WARREN / LAUGHLIN BRIAN J / MIKESKA KURT RICHARD / TORARDI CARMINE / VERNOOY PAUL DOUGLAS

Abstract

THICK-FILM PASTES CONTAINING LEAD-TELLURIUM-BORON-OXIDES, AND THEIR USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES

CARROLL ALAN FREDERICK / HANG KENNETH WARREN / LAUGHLIN BRIAN J / MIKESKA KURT RICHARD / TORARDI CARMINE / VERNOOY PAUL DOUGLAS

Abstract

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Titel:

THICK-FILM PASTES CONTAINING LEAD-TELLURIUM-BORON-OXIDES, AND THEIR USE IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES

Weitere Titelangaben:

DICKSCHICHTPASTEN MIT BLEI-TELLUR-BOR-OXIDEN SOWIE IHRE VERWENDUNG BEI DER HERSTELLUNG VON HALBLEITERBAUELEMENTEN
PÂTES POUR FILM ÉPAIS CONTENANT DES OXYDES DE PLOMB-TELLURE-BORE, ET LEUR UTILISATION DANS LA FABRICATION DE DISPOSITIFS SEMI-CONDUCTEURS

Beteiligte:

CARROLL ALAN FREDERICK (Autor:in) / HANG KENNETH WARREN (Autor:in) / LAUGHLIN BRIAN J (Autor:in) / MIKESKA KURT RICHARD (Autor:in) / TORARDI CARMINE (Autor:in) / VERNOOY PAUL DOUGLAS (Autor:in)

Erscheinungsdatum:

05.10.2016

Medientyp:

Patent

Format:

Elektronische Ressource

Sprache:

Englisch

Klassifikation:

IPC: C03C Chemische Zusammensetzungen für Gläser, Glasuren oder Emails , CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS / B22F Verarbeiten von Metallpulver , WORKING METALLIC POWDER / C04B Kalk , LIME / H01B CABLES , Kabel / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES

Europäisches Patentamt | 2015

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