Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
BRAZING FILLER METAL, BRAZING FILLER METAL PASTE, CERAMIC CIRCUIT SUBSTRATE, AND CERAMIC MASTER CIRCUIT SUBSTRATE
To provide a brazing material for maintaining bonding strength between ceramic substrate and metal plate at a conventionally attainable level, while addition amount of In is reduced, and a brazing material paste using the same. A mixture powder provided by mixing alloy powder composed of Ag, In, and Cu, Agpowder, and active metal hydride powder, the mixture powder containing active metal hydride powder with a 10-to-25-µm equivalent circle average particle diameter by 0.5 to 5. 0 mass%, the equivalent circle average particle diameters for the alloy powder, Ag powder, and active metal hydride powder having a relationship: alloy powder ¥ active metal hydride powder > Ag powder, and the powder mixture having a particle size distribution of d10 of 3 to 10 µm, d50 of 10 to 35 µm, and d90 of 30 to 50 µm, and in the frequency distribution, a peak of the distribution existing between d50 and d90.
BRAZING FILLER METAL, BRAZING FILLER METAL PASTE, CERAMIC CIRCUIT SUBSTRATE, AND CERAMIC MASTER CIRCUIT SUBSTRATE
To provide a brazing material for maintaining bonding strength between ceramic substrate and metal plate at a conventionally attainable level, while addition amount of In is reduced, and a brazing material paste using the same. A mixture powder provided by mixing alloy powder composed of Ag, In, and Cu, Agpowder, and active metal hydride powder, the mixture powder containing active metal hydride powder with a 10-to-25-µm equivalent circle average particle diameter by 0.5 to 5. 0 mass%, the equivalent circle average particle diameters for the alloy powder, Ag powder, and active metal hydride powder having a relationship: alloy powder ¥ active metal hydride powder > Ag powder, and the powder mixture having a particle size distribution of d10 of 3 to 10 µm, d50 of 10 to 35 µm, and d90 of 30 to 50 µm, and in the frequency distribution, a peak of the distribution existing between d50 and d90.
BRAZING FILLER METAL, BRAZING FILLER METAL PASTE, CERAMIC CIRCUIT SUBSTRATE, AND CERAMIC MASTER CIRCUIT SUBSTRATE
LÖTFÜLLMETALL, LÖTFÜLLMETALLPASTE, KERAMISCHES SCHALTUNGSSUBSTRAT UND KERAMISCHES SCHALTUNGSMASTERSUBSTRAT
MÉTAL D'APPORT DE BRASAGE, PÂTE MÉTALLIQUE D'APPORT DE BRASAGE, SUBSTRAT CÉRAMIQUE POUR CIRCUIT ET SUBSTRAT MAÎTRE CÉRAMIQUE POUR CIRCUIT
IMAMURA HISAYUKI (Autor:in) / FUJITA SUGURU (Autor:in) / WATANABE JUNICHI (Autor:in)
01.02.2017
Patent
Elektronische Ressource
Englisch
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