Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
BONDED BODY AND POWER MODULE SUBSTRATE
The bonded body of the present invention includes: a ceramic member made of ceramics; and a Cu member which is made of Cu or a Cu alloy and bonded to the ceramic member through a Cu-P-Sn-based brazing filler material and a Ti material, wherein a Cu-Sn layer, which is positioned close to the ceramic member and in which Sn forms a solid solution with Cu, and an intermetallic compound layer which is positioned between the Cu member and the Cu-Sn layer and contains P and Ti, are formed at a bonded interface between the ceramic member and the Cu member.
BONDED BODY AND POWER MODULE SUBSTRATE
The bonded body of the present invention includes: a ceramic member made of ceramics; and a Cu member which is made of Cu or a Cu alloy and bonded to the ceramic member through a Cu-P-Sn-based brazing filler material and a Ti material, wherein a Cu-Sn layer, which is positioned close to the ceramic member and in which Sn forms a solid solution with Cu, and an intermetallic compound layer which is positioned between the Cu member and the Cu-Sn layer and contains P and Ti, are formed at a bonded interface between the ceramic member and the Cu member.
BONDED BODY AND POWER MODULE SUBSTRATE
VERBUNDKÖRPER UND LEISTUNGSMODULSUBSTRAT
CORPS COLLÉ ET SUBSTRAT DE MODULE DE PUISSANCE
TERASAKI NOBUYUKI (Autor:in) / NAGATOMO YOSHIYUKI (Autor:in)
06.07.2016
Patent
Elektronische Ressource
Englisch
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